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74LVC623ADB,112

NXP Semiconductors

74LVC623ADB,112 by NXP Semiconductors

BUS TRANSCEIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,850 parts In-Stock

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4,850

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Anansix

USA . 2,482 parts In-Stock

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2,482

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Digiode

USA . 1,714 parts In-Stock

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1,714

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Distributors (Availability)

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Northwest PG Solutions

USA . 2,285 parts In-Stock

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$3.253

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2,285

$3.253

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Andel Nordic

Denmark . 1,666 parts In-Stock

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$8.657

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$8.311

10k+ parts

$8.311

1,666

$8.657

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$8.311

$8.311

Corohmni

South Africa . 217 parts In-Stock

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$11.397

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217

$11.397

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AZTECH Wire

Italy . 225 parts In-Stock

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$16.270

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225

$16.270

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Microchip USA

USA . 415 parts In-Stock

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$25.013

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415

$25.013

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$26.951

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$24.525

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$22.100

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500

$26.951

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$22.100

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One Stop Electronics

USA . 204 parts In-Stock

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$31.000

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204

$31.000

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QUARKTWIN TECHNOLOGY LTD

USA . 7,572 parts In-Stock

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UNI Independent Distributors

Spain . 5,332 parts In-Stock

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Corphita

USA . 1,343 parts In-Stock

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Native Components

USA . 747 parts In-Stock

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$2.868

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747

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$2.868

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Technical Specifications

Bus Driver & Transceivers 74LVC623ADB,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.3 mm

Trade Compliance

74LVC623ADB,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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