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74LVC1GU04GW,125

NXP Semiconductors

74LVC1GU04GW,125 by NXP Semiconductors

NXP Semiconductors' 74LVC1GU04GW,125 is a CMOS Logic Gate with Vsup of 1.8V and tpd of 6.5ns. It operates in automotive-grade temperature range (-40 to 125 °C) and has a load capacitance of 50pF. Ideal for applications requiring fast propagation delay and low power consumption in compact designs.

Median Price

$0.077

Lifecycle Status

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23

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1k+

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Arrow

USA . 3,690 parts In-Stock

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$0.042

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3,690

$0.042

$0.020

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$0.017

DigiKey

USA . 25,930 parts In-Stock

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$0.110

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$0.054

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$0.044

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Mouser Electronics

USA . 12,567 parts In-Stock

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$0.110

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$0.054

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$0.043

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$0.038

12,567

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Newark

USA . 2,565 parts In-Stock

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Rochester

USA . 153,364 parts In-Stock

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Verical

USA . 135,000 parts In-Stock

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TTI

USA . 21,000 parts In-Stock

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Chip1Stop

Japan . 16,155 parts In-Stock

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Future Electronics

Canada . 15,000 parts In-Stock

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Farnell

UK . 2,950 parts In-Stock

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Element14

Singapore . 1,105 parts In-Stock

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Digiode

USA . 3,673 parts In-Stock

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Nova Conductors

Japan . 91 parts In-Stock

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TME

Poland . 8,949 parts In-Stock

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$0.130

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$0.069

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$0.053

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$0.051

8,949

$0.130

$0.069

$0.053

$0.051

Component Electronics Inc.

Canada . 2,665 parts In-Stock

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$1.540

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$1.150

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$1.000

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Chip Stock

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IBS Electronics

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NAC Semi

USA . 12,000 parts In-Stock

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Vyrian

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VNN

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ComSIT Distribution GmbH

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Distributors (Availability)

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Ampacity Inc.

Singapore . 19,359 parts In-Stock

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Corphita

USA . 3,504 parts In-Stock

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Component Stockers USA

USA . 165,949 parts In-Stock

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AZTECH Wire

Italy . 4,075 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Corohmni

South Africa . 121 parts In-Stock

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$10.867

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$29.419

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$26.771

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Eastek

USA . 27,000 parts In-Stock

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

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Glotronic Ltd.

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Supply Digital

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Argo Parts USA

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Perfect Parts

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Overview

Discover the power of NXP Semiconductors with the 74LVC1GU04GW,125 Logic Gate. This high-quality component offers unmatched reliability and performance for a variety of applications. With a compact design and wide temperature range, this product is perfect for automotive use and beyond. Experience the value and benefits of NXP technology with this versatile logic gate that ensures optimal functionality and efficiency in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable applications.

Surface Mount: YES

With surface mount capability, this product can be easily integrated onto PCBs, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V makes this product energy-efficient, reducing power consumption.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product has fast response times, ensuring quick signal propagation.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with a wide range of systems, making it versatile for different applications.

No. of Terminals: 5

With 5 terminals, this product offers flexible connectivity options, allowing for various configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make this product space-saving and suitable for densely populated PCBs.

Maximum I (ol): 24 Amp

The high maximum output current of 24A allows this product to drive heavy loads, making it suitable for power applications.

Propagation Delay (tpd): 6.5 ns

The short propagation delay of 6.5ns ensures fast signal processing, ideal for high-speed applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand harsh environmental conditions, making it reliable in industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this product to function in extreme cold conditions, enhancing its versatility.

Terminal Finish: Tin (Sn)

The tin terminal finish provides excellent solderability, ensuring reliable connections during assembly.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting orientations, allowing for easy integration into different PCB layouts.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1mm minimizes the overall profile of the product, suitable for space-constrained designs.

Width: 1.25 mm

With a width of 1.25mm, this product is compact and can be easily incorporated into tight spaces on a PCB.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage of 1.65V ensures compatibility with a wide range of power sources, enhancing the product's versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30s ensures proper soldering during assembly, maintaining product integrity.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for high-temperature soldering, ensuring secure connections on the PCB.

Length: 2.05 mm

The length of 2.05mm provides a compact footprint, making this product suitable for applications with limited board space.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures this product can withstand the temperature fluctuations and harsh conditions encountered in automotive environments.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it suitable for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING

The gull-wing terminal form provides secure and reliable connections, ensuring stability during operation.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, this product offers precise connectivity, making it suitable for high-density PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V provides compatibility with a wide range of power sources, increasing the product's versatility.

Technical Specifications

Logic Gates 74LVC1GU04GW,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1GU04GW,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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