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74HCT2G126DP,125

NXP Semiconductors

74HCT2G126DP,125 by NXP Semiconductors

NXP Semiconductors' 74HCT2G126DP,125 is a Bus Driver & Transceiver with 36ns Propagation Delay at 5V. It features 3-STATE Output Characteristics and operates in Automotive Grade conditions. This dual-function chip has a small outline package style suitable for surface mount applications.

Median Price

$0.112

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 304,275 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

304,275

-

$0.119

$0.099

$0.088

Verical

USA . 277,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.104

277,680

-

-

-

$0.104

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,722 parts In-Stock

1+ parts

$0.093

100+ parts

-

1k+ parts

-

10k+ parts

-

2,722

$0.093

-

-

-

Vyrian

USA . 4,598 parts In-Stock

1+ parts

-

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4,598

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Anansix

USA . 423 parts In-Stock

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-

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423

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 290,797 parts In-Stock

1+ parts

$0.083

100+ parts

-

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290,797

$0.083

-

-

-

Corphita

USA . 414 parts In-Stock

1+ parts

$0.088

100+ parts

-

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414

$0.088

-

-

-

Andel Nordic

Denmark . 3,867 parts In-Stock

1+ parts

$3.467

100+ parts

-

1k+ parts

$3.328

10k+ parts

$3.328

3,867

$3.467

-

$3.328

$3.328

Microchip USA

USA . 191 parts In-Stock

1+ parts

$15.130

100+ parts

$15.130

1k+ parts

$15.130

10k+ parts

$15.130

191

$15.130

$15.130

$15.130

$15.130

AZTECH Wire

Italy . 632 parts In-Stock

1+ parts

$16.280

100+ parts

-

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632

$16.280

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Continental Prestige Electronics

USA . 315,475 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.117

10k+ parts

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315,475

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-

$0.117

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UNI Independent Distributors

Spain . 6,424 parts In-Stock

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6,424

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Northwest PG Solutions

USA . 1,696 parts In-Stock

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1,696

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Native Components

USA . 604 parts In-Stock

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604

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Overview

Unlock seamless communication and high-performance connectivity with the NXP Semiconductors 74HCT2G126DP,125. Designed with precision and reliability in mind, this Bus Driver & Transceiver is a game-changer in the industry. With a compact design and advanced features, this product offers exceptional value and benefits to customers across various applications. Experience top-notch quality and unmatched advantages with NXP Semiconductors' innovative technology. Elevate your projects with the 74HCT2G126DP,125 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material offers good durability and reliability, making the product suitable for long-term use.

Propagation Delay At Nominal Supply: 36 ns

Low propagation delay ensures fast signal transmission, improving the overall performance of the bus driver and transceiver.

Surface Mount: YES

Surface mount capability makes installation easy and saves space on the PCB.

Nominal Supply Voltage / Vsup (V): 5

Compatibilty with standard 5V supply makes it easy to integrate into existing systems.

Maximum I (ol): 6 Amp

High output current capability allows the device to drive multiple loads without issues.

Output Characteristics: 3-STATE

3-state output provides flexibility in controlling the bus lines, allowing for efficient data transmission.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range ensures the product can withstand harsh environmental conditions, making it suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, leading to efficient operation and reliable data transmission.

Technical Specifications

Bus Driver & Transceivers 74HCT2G126DP,125 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE HIGH

Family:

HCT

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

36 ns

Propagation Delay (tpd):

36 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

74HCT2G126DP,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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