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74HCT147D,652

NXP Semiconductors

74HCT147D,652 by NXP Semiconductors

ENCODER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.840

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 938 parts In-Stock

1+ parts

-

100+ parts

$0.825

1k+ parts

$0.684

10k+ parts

$0.610

938

-

$0.825

$0.684

$0.610

Verical

USA . 938 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.855

10k+ parts

$0.763

938

-

-

$0.855

$0.763

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 979 parts In-Stock

1+ parts

$0.330

100+ parts

-

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-

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979

$0.330

-

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Vyrian

USA . 5,686 parts In-Stock

1+ parts

-

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5,686

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Anansix

USA . 1,575 parts In-Stock

1+ parts

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1,575

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,792 parts In-Stock

1+ parts

$0.312

100+ parts

-

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2,792

$0.312

-

-

-

Andel Nordic

Denmark . 2,500 parts In-Stock

1+ parts

$1.750

100+ parts

-

1k+ parts

$1.225

10k+ parts

$1.225

2,500

$1.750

-

$1.225

$1.225

Northwest PG Solutions

USA . 64 parts In-Stock

1+ parts

$3.107

100+ parts

-

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-

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64

$3.107

-

-

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AZTECH Wire

Italy . 311 parts In-Stock

1+ parts

$21.610

100+ parts

-

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311

$21.610

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QUARKTWIN TECHNOLOGY LTD

USA . 13,418 parts In-Stock

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13,418

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UNI Independent Distributors

Spain . 7,597 parts In-Stock

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7,597

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Microchip USA

USA . 5,314 parts In-Stock

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5,314

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Native Components

USA . 863 parts In-Stock

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$2.740

10k+ parts

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863

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$2.740

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Perfect Parts

USA . 712 parts In-Stock

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712

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Technical Specifications

Digital Arithmetic Circuits 74HCT147D,652 attributes and parameters. Explore more Digital Arithmetic Circuits devices from NXP Semiconductors

Specs

Additional Features:

9 TO 4 LINE PRIORITY ENCODER

Family:

HCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

53 ns

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

74HCT147D,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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