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74HC7266D,652

NXP Semiconductors

74HC7266D,652 by NXP Semiconductors

XNOR GATE; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.541

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,332 parts In-Stock

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-

100+ parts

$0.541

1k+ parts

$0.449

10k+ parts

$0.400

2,332

-

$0.541

$0.449

$0.400

Distributors (In-Stock)

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Digiode

USA . 326 parts In-Stock

1+ parts

$0.217

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$0.217

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Voyager Components

USA . 238 parts In-Stock

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$0.406

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$0.406

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$0.406

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$0.406

238

$0.406

$0.406

$0.406

$0.406

Vyrian

USA . 8,716 parts In-Stock

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Anansix

USA . 2,200 parts In-Stock

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Semtec, LLC

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A&K Electronics

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Rotakorn

Sweden . 14 parts In-Stock

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Bristol Electronics

USA . 14 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,795 parts In-Stock

1+ parts

$0.205

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$0.205

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AZTECH Wire

Italy . 703 parts In-Stock

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$8.770

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$8.770

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Microchip USA

USA . 376 parts In-Stock

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$9.733

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$9.733

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$14.764

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$13.435

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$12.106

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650

$14.764

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Corohmni

South Africa . 61 parts In-Stock

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$31.508

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UNI Independent Distributors

Spain . 1,518 parts In-Stock

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Perfect Parts

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Northwest PG Solutions

USA . 480 parts In-Stock

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$4.425

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Native Components

USA . 454 parts In-Stock

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$4.380

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GreenTree Electronics

Israel . 50 parts In-Stock

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Technical Specifications

Logic Gates 74HC7266D,652 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74HC7266D,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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