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74HC670N

NXP Semiconductors

74HC670N by NXP Semiconductors

STANDARD SRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,623 parts In-Stock

1+ parts

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2,623

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Anansix

USA . 1,954 parts In-Stock

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1,954

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ComSIT Distribution GmbH

Germany . 1,725 parts In-Stock

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1,725

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ECAB

Sweden . 300 parts In-Stock

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300

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LWI Electronics Inc

India . 298 parts In-Stock

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298

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Jameco Electronics

USA . 152 parts In-Stock

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152

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EMSNET

USA . 25 parts In-Stock

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25

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Vyrian

USA . 21 parts In-Stock

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21

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Semi Source

USA . 3 parts In-Stock

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3

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Ashlea Components Ltd

UK . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 123 parts In-Stock

1+ parts

$6.195

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123

$6.195

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One Stop Electronics

USA . 646 parts In-Stock

1+ parts

$14.000

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646

$14.000

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UNI Independent Distributors

Spain . 6,371 parts In-Stock

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Corphita

USA . 3,266 parts In-Stock

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3,266

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Robosynatics

Brazil . 1,870 parts In-Stock

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$2.830

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$2.621

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$2.621

1,870

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$2.830

$2.621

$2.621

Lucentia Tech

USA . 1,870 parts In-Stock

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$2.830

1k+ parts

$2.621

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$2.621

1,870

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$2.830

$2.621

$2.621

Perfect Parts

USA . 730 parts In-Stock

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730

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Northwest PG Solutions

USA . 700 parts In-Stock

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$6.071

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700

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$6.071

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Assy Fe

Spain . 300 parts In-Stock

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300

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Technical Specifications

SRAM 74HC670N attributes and parameters. Explore more SRAM devices from NXP Semiconductors

Specs

Maximum Access Time:

59 ns

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

21.6 mm

Memory Density:

16 bit

Memory IC Type:

Memory Width:

4

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

16

No. of Words:

4 words

No. of Words Code:

4

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4X4

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74HC670N Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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