Loading...

74HC670DB,112

NXP Semiconductors

74HC670DB,112 by NXP Semiconductors

STANDARD SRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Power Supplies (V): 2/6;

Median Price

$1.030

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 762 parts In-Stock

1+ parts

-

100+ parts

$1.030

1k+ parts

$0.855

10k+ parts

$0.762

762

-

$1.030

$0.855

$0.762

DigiKey

USA . 762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.450

10k+ parts

$0.450

762

-

-

$0.450

$0.450

Verical

USA . 762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.069

10k+ parts

$0.953

762

-

-

$1.069

$0.953

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,542 parts In-Stock

1+ parts

$0.411

100+ parts

-

1k+ parts

-

10k+ parts

-

1,542

$0.411

-

-

-

Vyrian

USA . 6,047 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,047

-

-

-

-

Anansix

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,607 parts In-Stock

1+ parts

$0.390

100+ parts

-

1k+ parts

-

10k+ parts

-

2,607

$0.390

-

-

-

Microchip USA

USA . 331 parts In-Stock

1+ parts

$0.635

100+ parts

-

1k+ parts

-

10k+ parts

-

331

$0.635

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 5,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,676

-

-

-

-

Northwest PG Solutions

USA . 1,270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,270

-

-

-

-

Native Components

USA . 696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

696

-

-

-

-

UNI Independent Distributors

Spain . 288 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

288

-

-

-

-

Technical Specifications

SRAM 74HC670DB,112 attributes and parameters. Explore more SRAM devices from NXP Semiconductors

Specs

Maximum Access Time:

59 ns

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Memory Density:

16 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

No. of Words:

4 words

No. of Words Code:

4

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4X4

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

74HC670DB,112 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19