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74HC58DB,112

NXP Semiconductors

74HC58DB,112 by NXP Semiconductors

AND-OR GATE; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

$0.394

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 993 parts In-Stock

1+ parts

-

100+ parts

$0.387

1k+ parts

$0.321

10k+ parts

$0.286

993

-

$0.387

$0.321

$0.286

Verical

USA . 993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.401

10k+ parts

$0.357

993

-

-

$0.401

$0.357

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,776 parts In-Stock

1+ parts

$0.155

100+ parts

-

1k+ parts

-

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-

4,776

$0.155

-

-

-

Vyrian

USA . 5,072 parts In-Stock

1+ parts

-

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-

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5,072

-

-

-

-

Anansix

USA . 1,206 parts In-Stock

1+ parts

-

100+ parts

-

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1,206

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,707 parts In-Stock

1+ parts

$0.147

100+ parts

-

1k+ parts

-

10k+ parts

-

4,707

$0.147

-

-

-

Microchip USA

USA . 120 parts In-Stock

1+ parts

$0.225

100+ parts

-

1k+ parts

-

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-

120

$0.225

-

-

-

AZTECH Wire

Italy . 125 parts In-Stock

1+ parts

$16.010

100+ parts

-

1k+ parts

-

10k+ parts

-

125

$16.010

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,631 parts In-Stock

1+ parts

-

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-

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15,631

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UNI Independent Distributors

Spain . 2,789 parts In-Stock

1+ parts

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2,789

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-

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Northwest PG Solutions

USA . 769 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.359

10k+ parts

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769

-

-

$4.359

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Native Components

USA . 493 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.315

10k+ parts

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493

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$4.315

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Technical Specifications

Logic Gates 74HC58DB,112 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Additional Features:

ASYMMETRICAL I/P'S

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

6

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

74HC58DB,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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