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74HC132N,652

NXP Semiconductors

74HC132N,652 by NXP Semiconductors

NXP Semiconductors' 74HC132N,652 is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage range of 2-6V, with propagation delay of 31ns. Ideal for automotive applications due to its Schmitt Trigger feature and operating temperature range of -40 to 125°C.

Median Price

$0.215

Lifecycle Status

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1k+

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Elektronika Sales Private Limited

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Vyrian

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Sensible Micro Corp

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Bristol Electronics

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Atlantic Semiconductor

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Microchip USA

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AZTECH Wire

Italy . 781 parts In-Stock

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Ampacity Inc.

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Overview

Elevate your electronic projects with the 74HC132N,652 by NXP Semiconductors, a high-quality logic gate that offers unmatched performance and reliability. Designed for various applications, this component boasts a wide range of advantages thanks to its innovative technology and superior manufacturing standards. From efficient signal processing to seamless integration, this product delivers exceptional value and benefits to customers seeking top-tier solutions for their projects. Experience the difference with the 74HC132N,652 and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 31 ns

Fast propagation delay ensures quick response times in logic operations.

No. of Functions: 4

Offers multiple logic functions in a single package, saving space and reducing complexity in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage for compatibility with common power sources.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliable performance in varied environmental conditions.

Schmitt Trigger: YES

Schmitt trigger feature helps in eliminating noise and providing hysteresis for cleaner signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operations.

Technical Specifications

Logic Gates 74HC132N,652 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

BULK

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

31 ns

Propagation Delay (tpd):

38 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

4.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74HC132N,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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