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74AUP1T1326GT,115

NXP Semiconductors

74AUP1T1326GT,115 by NXP Semiconductors

NXP Semiconductors' 74AUP1T1326GT,115 is a CMOS bus driver with 17.3ns propagation delay, 30pF load capacitance, and 1.7A max I (ol). It operates at -40 to 85°C and supports a power supply of 1.2/3.3V. Ideal for industrial applications requiring true output polarity control in a small outline package with surface mount capability.

Median Price

$0.462

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 4,700 parts In-Stock

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-

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$0.497

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$0.412

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$0.367

4,700

-

$0.497

$0.412

$0.367

Verical

USA . 3,015 parts In-Stock

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$0.428

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$0.381

3,015

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$0.428

$0.381

Distributors (In-Stock)

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Digiode

USA . 73 parts In-Stock

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$0.164

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Chip Stock

USA . 131,000 parts In-Stock

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Vyrian

USA . 7,900 parts In-Stock

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DigiKey Marketplace

USA . 4,700 parts In-Stock

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$0.180

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Anansix

USA . 2,693 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,353 parts In-Stock

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$0.147

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Corphita

USA . 2,837 parts In-Stock

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$0.156

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AZTECH Wire

Italy . 388 parts In-Stock

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$15.000

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388

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QUARKTWIN TECHNOLOGY LTD

USA . 25,468 parts In-Stock

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UNI Independent Distributors

Spain . 7,652 parts In-Stock

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Microchip USA

USA . 5,602 parts In-Stock

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Continental Prestige Electronics

USA . 4,700 parts In-Stock

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$0.208

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Northwest PG Solutions

USA . 1,732 parts In-Stock

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Andel Nordic

Denmark . 634 parts In-Stock

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Native Components

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Overview

Enhance your electronic designs with the 74AUP1T1326GT,115 from NXP Semiconductors! This high-quality Bus Driver & Transceiver offers reliable performance and versatility for a wide range of applications. With its advanced technology and industrial-grade temperature tolerance, this product ensures seamless operation in challenging environments. Trust NXP Semiconductors for top-notch solutions that deliver exceptional value and benefits to meet your design needs. Elevate your projects with the 74AUP1T1326GT,115 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications without adding unnecessary weight.

Propagation Delay At Nominal Supply: 17.3 ns

The low propagation delay ensures fast and efficient signal transmission, making the product suitable for high-speed communication requirements.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Load Capacitance (CL): 30 pF

With a moderate load capacitance, the product can effectively drive connected loads while maintaining signal integrity.

Power Supplies (V): 1.2/3.3

Support for multiple power supply voltages allows for flexibility in system design and compatibility with a range of devices.

No. of Terminals: 6

The 6 terminals provide ample connectivity options, enabling the product to interface with multiple components or systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making the product suitable for compact designs and reducing overall system footprint.

Maximum I (ol): 1.7 Amp

The high maximum output current rating ensures the product can drive demanding loads without overheating or performance degradation.

Maximum Operating Temperature: 85 °C

The wide operating temperature range allows the product to function reliably in diverse environmental conditions, enhancing its versatility and usability.

Output Characteristics: 3-STATE

The 3-state output feature enables the product to drive tri-state bus systems, offering flexibility and control over signal routing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can perform in cold environments without risking damage or malfunction.

Technology: CMOS

The use of CMOS technology results in low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers 74AUP1T1326GT,115 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE HIGH

JESD-30 Code:

R-PDSO-N6

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

17.3 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

74AUP1T1326GT,115 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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