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74ALVT16823DGG,112

NXP Semiconductors

74ALVT16823DGG,112 by NXP Semiconductors

BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$5.330

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 875 parts In-Stock

1+ parts

-

100+ parts

$5.330

1k+ parts

$4.770

10k+ parts

$4.490

875

-

$5.330

$4.770

$4.490

DigiKey

USA . 875 parts In-Stock

1+ parts

-

100+ parts

$3.180

1k+ parts

-

10k+ parts

-

875

-

$3.180

-

-

Verical

USA . 875 parts In-Stock

1+ parts

-

100+ parts

$6.662

1k+ parts

$5.963

10k+ parts

$5.612

875

-

$6.662

$5.963

$5.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,355 parts In-Stock

1+ parts

$2.907

100+ parts

-

1k+ parts

-

10k+ parts

-

2,355

$2.907

-

-

-

Vyrian

USA . 3,964 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,964

-

-

-

-

Anansix

USA . 1,810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,810

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,513 parts In-Stock

1+ parts

$2.754

100+ parts

-

1k+ parts

-

10k+ parts

-

3,513

$2.754

-

-

-

Andel Nordic

Denmark . 443 parts In-Stock

1+ parts

$17.730

100+ parts

-

1k+ parts

$12.413

10k+ parts

$12.413

443

$17.730

-

$12.413

$12.413

Microchip USA

USA . 1,621 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,621

-

-

-

-

Northwest PG Solutions

USA . 1,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,050

-

-

-

-

Continental Prestige Electronics

USA . 875 parts In-Stock

1+ parts

-

100+ parts

$3.670

1k+ parts

-

10k+ parts

-

875

-

$3.670

-

-

Native Components

USA . 758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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758

-

-

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UNI Independent Distributors

Spain . 125 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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125

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-

-

-

Technical Specifications

Bus Driver & Transceivers 74ALVT16823DGG,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

USER SELECTABLE 3.3V VCC

Family:

ALVT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14.15 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

9

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.1 ns

Propagation Delay (tpd):

5.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

6.25 mm

Trade Compliance

74ALVT16823DGG,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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