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74AHCT1G66GW

NXP Semiconductors

74AHCT1G66GW by NXP Semiconductors

74AHCT1G66GW by NXP Semiconductors is a CMOS SPST switch with 5V supply voltage, 30 ohm on-state resistance, and 17ns switch-on/off time. It is ideal for automotive applications due to its small size (2mm length, 1.25mm width) and high temperature tolerance (-40 to 125°C). The device features separate outputs and make-before-break switching for efficient signal routing in compact electronic systems.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Bristol Electronics

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Atlantic Semiconductor

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Vyrian

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Anansix

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Digiode

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Nova Conductors

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Ampacity Inc.

Singapore . 1,031 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 6,541 parts In-Stock

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Aztec Data Supply Inc.

USA . 808 parts In-Stock

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Corohmni

South Africa . 124 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Glotronic Ltd.

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Supply Digital

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Aranea Global

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Perfect Parts

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Overview

Upgrade your electronic projects with the high-quality 74AHCT1G66GW by NXP Semiconductors. Expertly crafted in a small outline, thin profile package, this multiplexer offers seamless switching capabilities for improved performance. Ideal for automotive applications, this versatile component ensures reliable operation even in extreme temperatures. Experience the benefits of superior technology and precision engineering with NXP Semiconductors, where innovation meets excellence. Elevate your designs with the 74AHCT1G66GW and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable and reliable plastic/epoxy material ensures longevity and stability for the product.

Surface Mount: YES

Enables easy installation and integration into various electronic devices and circuit boards.

Nominal Supply Voltage (Vsup): 5 V

Operates efficiently within the standard 5V supply voltage, making it compatible with most systems.

Power Supplies (V): 5

Consistent power supply of 5V ensures proper functioning of the multiplexer/switch.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for applications where heat may be a concern.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Multiplexers & Switches 74AHCT1G66GW attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Nominal Off-state Isolation:

50 dB

Maximum On-state Resistance (Ron):

30 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

17 ns

Maximum Switch-on Time:

17 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

74AHCT1G66GW Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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