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74AHCT1G66GW,165

NXP Semiconductors

74AHCT1G66GW,165 by NXP Semiconductors

NXP Semiconductors' 74AHCT1G66GW,165 is a CMOS SPST switch with 5V supply voltage. It offers fast switching times of 17ns and low on-state resistance of 30 ohm. Ideal for automotive applications due to its small size, high temperature range up to 125°C, and make-before-break switching capability.

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Lifecycle Status

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6

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Chip Stock

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Aztec Data Supply Inc.

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AZTECH Wire

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Corohmni

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Overview

Experience seamless and efficient electronic switching with the 74AHCT1G66GW,165 by NXP Semiconductors. This high-quality multiplexer offers unparalleled reliability and precision, making it ideal for a wide range of applications. With its compact design, advanced technology, and automotive-grade temperature grade, this switch ensures optimal performance in any setting. Upgrade your systems with the best in the industry and enjoy the benefits of fast on/off switching, superior isolation, and minimal power consumption. Trust NXP Semiconductors to deliver exceptional quality and value with every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer/switch, ensuring longevity and reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is a common standard in many electronic systems, making this multiplexer/switch compatible with a wide range of devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this multiplexer/switch can withstand harsh environmental conditions and continuous usage without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this multiplexer/switch energy efficient and reliable in various applications.

Technical Specifications

Multiplexers & Switches 74AHCT1G66GW,165 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Nominal Off-state Isolation:

50 dB

Maximum On-state Resistance (Ron):

30 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

17 ns

Maximum Switch-on Time:

17 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

74AHCT1G66GW,165 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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