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74AHC1G66GW-R

NXP Semiconductors

74AHC1G66GW-R by NXP Semiconductors

74AHC1G66GW-R by NXP Semiconductors is a CMOS SPST switch with a max on-state resistance of 110Ω and operates at a nominal voltage of 5V. It features a compact SO thin profile package, ideal for automotive applications. With an operating temp range of -40 °C to 125 °C, it ensures reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

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Anansix

USA . 2,892 parts In-Stock

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Vyrian

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One Stop Electronics

USA . 553 parts In-Stock

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UNI Independent Distributors

Spain . 8,279 parts In-Stock

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Corphita

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Northwest PG Solutions

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Native Components

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Overview

Unlock unparalleled performance with the 74AHC1G66GW-R from NXP Semiconductors, a trusted leader in high-quality IC solutions. This versatile multiplexer delivers seamless signal control for automotive and industrial applications, ensuring reliability even in extreme temperatures. Its compact design and low power consumption make it perfect for space-constrained projects. Elevate your designs with this efficient, robust component that maximizes value while minimizing footprint!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent insulation and protects against environmental factors, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern electronic circuits, saving board space.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy placement on PCBs, optimizing circuit design and layout.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard voltage level makes it compatible with most digital circuits and reduces power supply complexity.

Power Supplies (V): 5

The device is designed to work with common power supply rails, making it easier to integrate into existing systems.

No. of Terminals: 5

With 5 terminals, this product is versatile enough to handle various configurations while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design enhance space efficiency on PCBs, allowing for denser component placement.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes this component suitable for demanding applications, such as automotive environments.

Minimum Operating Temperature: -40 °C

With a wide temperature range, it can function in extreme environments, ensuring reliable operation across different climatic conditions.

Terminal Position: DUAL

Dual terminal positioning allows for flexible connection options, supporting various layout designs and ease of soldering.

Other IC type: SPST

SPST configuration simplifies design considerations for switching applications, providing an effective solution for on/off control.

Maximum On-state Resistance (Ron): 110 ohm

Low on-state resistance ensures minimal power loss during operation, improving overall system efficiency.

Maximum Switch-on Time: 35 ns

Fast switch-on time enhances the performance of high-speed applications, allowing for quick signal routing.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this component meets rigorous standards for performance and reliability in vehicles.

Technology: CMOS

CMOS technology supports low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide secure solder joints, enhancing the mechanical stability of the component on the PCB.

Terminal Pitch: 0.635 mm

The fine pitch allows for compact designs and high-density layouts, critical for modern electronic circuits.

Switching (V): MAKE-BEFORE-BREAK

This switching method ensures seamless transitions between states, preventing signal interruptions in critical applications.

Technical Specifications

Multiplexers & Switches 74AHC1G66GW-R attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G5

Normal Position (V):

NO

No. of Functions:

1

No. of Terminals:

5

Maximum On-state Resistance (Ron):

110 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-on Time:

35 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

74AHC1G66GW-R Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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