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27C512-15FA

NXP Semiconductors

27C512-15FA by NXP Semiconductors

OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS;

Median Price

$7.280

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 6 parts In-Stock

1+ parts

$2.230

100+ parts

$1.670

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$1.450

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6

$2.230

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Bristol Electronics

USA . 12 parts In-Stock

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$7.280

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Forefront Electronics and Design

USA . 3 parts In-Stock

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$36.750

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Digiode

USA . 4,445 parts In-Stock

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Anansix

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900

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Vyrian

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422

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North Shore Components

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Q Components

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Electronic Expediters

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Prism Electronics

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Connector Distribution Corp

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Right Parts Inc.

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Mil-Aero Solutions, Inc.

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Tech-Mark Corp

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Pegasus Components GmbH

Germany . 16 parts In-Stock

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Electronics Depot

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ECAB

Sweden . 7 parts In-Stock

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LWI Electronics Inc

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Sogenti Electronics

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Distributors (Availability)

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Native Components

USA . 249 parts In-Stock

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$5.865

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249

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One Stop Electronics

USA . 1,485 parts In-Stock

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$17.000

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Corphita

USA . 1,452 parts In-Stock

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Northwest PG Solutions

USA . 1,106 parts In-Stock

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UNI Independent Distributors

Spain . 928 parts In-Stock

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Perfect Parts

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Assy Fe

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Technical Specifications

OTP ROM 27C512-15FA attributes and parameters. Explore more OTP ROM devices from NXP Semiconductors

Specs

Maximum Access Time:

150 ns

JESD-30 Code:

R-CDIP-T28

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX8

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

27C512-15FA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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