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NMC27C64QE200

National Semiconductor

NMC27C64QE200 by National Semiconductor

NMC27C64QE200 by National Semiconductor is an 8KX8 EPROM with 65536 bit memory density. It operates at a max temperature of 85°C and has a programming voltage of 13V. Ideal for industrial applications requiring reliable non-volatile memory storage in parallel configuration.

Median Price

$29.530

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Overview

Upgrade your electronic devices with the NMC27C64QE200 EPROM by National Semiconductor, a trusted manufacturer known for top-quality components. Ideal for industrial applications, this memory chip offers reliable performance and fast access times, making it a valuable addition to any project. With a wide operating temperature range and low standby current, this EPROM delivers efficiency and durability. Trust National Semiconductor for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material:

CERAMIC, GLASS-SEALED - Provides durability and protection for the EPROM, ensuring longevity.

Package Shape:

RECTANGULAR - Allows for easy integration into various electronic devices.

Operating Mode:

ASYNCHRONOUS - Enables independent operation without the need for synchronization, offering flexibility.

Input/Output Type:

COMMON - Simplifies connectivity with other components, enhancing compatibility.

Nominal Supply Voltage / Vsup (V):

5 - Standard voltage level for reliable performance in a variety of applications.

Power Supplies (V):

5 - Matches the nominal supply voltage for consistent power delivery.

No. of Terminals:

28 - Sufficient terminals for connections without overcrowding the package.

Package Style (Meter):

IN-LINE, WINDOW - Offers a compact design with visibility for easy installation and monitoring.

Maximum Operating Temperature:

85 °C - Can withstand high temperatures without compromising functionality.

Organization:

8KX8 - Arrangement of memory cells for efficient storage and retrieval of data.

Output Characteristics:

3-STATE - Allows for multiple output states, enhancing versatility in data transmission.

Minimum Operating Temperature:

40 °C - Capable of functioning in extreme cold conditions.

Terminal Finish:

Tin/Lead (Sn/Pb) - Provides a reliable and conductive finish for secure connections.

Terminal Position:

DUAL - Offers flexibility in mounting and installation options.

Maximum Seated Height:

5.72 mm - Compact design for space-saving applications.

Width:

15.24 mm - Slim profile for easy integration into various electronic setups.

Minimum Supply Voltage (Vsup):

4.5 V - Ensures operational stability even at lower voltage levels.

Programming Voltage (V):

13 - Allows for easy programming of the EPROM for customized applications.

Temperature Grade:

INDUSTRIAL - Meets industrial standards for rugged performance in harsh environments.

Technology:

CMOS - Utilizes CMOS technology for low power consumption and high-speed operation.

Parallel or Serial:

PARALLEL - Enables simultaneous data transfer for faster operation.

Terminal Form:

THROUGH-HOLE - Secure terminal connections for reliable data transmission.

Maximum Supply Current:

20 mA - Efficient power consumption for energy-saving applications.

No. of Words:

8192 words - Offers ample storage capacity for data retention.

Memory Width:

8 - Wide memory data width for storing and accessing information efficiently.

Terminal Pitch:

2.54 mm - Standard pitch size for easy mounting on PCBs.

No. of Words Code:

8K - Indicates the memory capacity of the EPROM for accurate data storage.

Maximum Supply Voltage (Vsup):

5.5 V - Safeguards the EPROM from voltage fluctuations for stable performance.

Memory Density:

65536 bit - High-density memory storage for storing large amounts of data.

Memory IC Type:

UVPROM - Utilizes UV erasable programmable read-only memory technology for easy reprogramming.

Maximum Standby Current:

0.0001 Amp - Low standby current consumption for energy-efficient operation.

Maximum Access Time:

200 ns - Provides quick access to stored data for fast processing speeds.

Technical Specifications

EPROM NMC27C64QE200 attributes and parameters. Explore more EPROM devices from National Semiconductor

Specs

Maximum Access Time:

200 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T28

JESD-609 Code:

e0

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

NMC27C64QE200 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

NSN

5962-99-793-7109, 5962997937109

NIIN

997937109

Manufacturer Highlights

National Semiconductor

National Semiconductor was an American semiconductor manufacturer which specialized in analog devices and subsystems, formerly with headquarters in Santa Clara, California. The company produced power management integrated circuits, display drivers, audio and operational amplifiers, communication interface products and data conversion solutions. National's key markets included wireless handsets, displays and a variety of broad electronics markets, including medical, automotive, industrial and test and measurement applications.On September 23, 2011, the company formally became part of Texas Instruments as the "Silicon Valley" division.

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