Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NMC27C64QE200 by National Semiconductor is an 8KX8 EPROM with 65536 bit memory density. It operates at a max temperature of 85°C and has a programming voltage of 13V. Ideal for industrial applications requiring reliable non-volatile memory storage in parallel configuration.
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CERAMIC, GLASS-SEALED - Provides durability and protection for the EPROM, ensuring longevity.
RECTANGULAR - Allows for easy integration into various electronic devices.
ASYNCHRONOUS - Enables independent operation without the need for synchronization, offering flexibility.
COMMON - Simplifies connectivity with other components, enhancing compatibility.
5 - Standard voltage level for reliable performance in a variety of applications.
5 - Matches the nominal supply voltage for consistent power delivery.
28 - Sufficient terminals for connections without overcrowding the package.
IN-LINE, WINDOW - Offers a compact design with visibility for easy installation and monitoring.
85 °C - Can withstand high temperatures without compromising functionality.
8KX8 - Arrangement of memory cells for efficient storage and retrieval of data.
3-STATE - Allows for multiple output states, enhancing versatility in data transmission.
40 °C - Capable of functioning in extreme cold conditions.
Tin/Lead (Sn/Pb) - Provides a reliable and conductive finish for secure connections.
DUAL - Offers flexibility in mounting and installation options.
5.72 mm - Compact design for space-saving applications.
15.24 mm - Slim profile for easy integration into various electronic setups.
4.5 V - Ensures operational stability even at lower voltage levels.
13 - Allows for easy programming of the EPROM for customized applications.
INDUSTRIAL - Meets industrial standards for rugged performance in harsh environments.
CMOS - Utilizes CMOS technology for low power consumption and high-speed operation.
PARALLEL - Enables simultaneous data transfer for faster operation.
THROUGH-HOLE - Secure terminal connections for reliable data transmission.
20 mA - Efficient power consumption for energy-saving applications.
8192 words - Offers ample storage capacity for data retention.
8 - Wide memory data width for storing and accessing information efficiently.
2.54 mm - Standard pitch size for easy mounting on PCBs.
8K - Indicates the memory capacity of the EPROM for accurate data storage.
5.5 V - Safeguards the EPROM from voltage fluctuations for stable performance.
65536 bit - High-density memory storage for storing large amounts of data.
UVPROM - Utilizes UV erasable programmable read-only memory technology for easy reprogramming.
0.0001 Amp - Low standby current consumption for energy-efficient operation.
200 ns - Provides quick access to stored data for fast processing speeds.
EPROM NMC27C64QE200 attributes and parameters. Explore more EPROM devices from National Semiconductor
Maximum Access Time:
Input/Output Type:
JESD-30 Code:
JESD-609 Code:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Power Supplies (V):
Programming Voltage (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
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Temperature Grade:
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Width:
NMC27C64QE200 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.61
SB
8542.32.00.60
NSN
5962-99-793-7109, 5962997937109
NIIN
997937109
National Semiconductor was an American semiconductor manufacturer which specialized in analog devices and subsystems, formerly with headquarters in Santa Clara, California. The company produced power management integrated circuits, display drivers, audio and operational amplifiers, communication interface products and data conversion solutions. National's key markets included wireless handsets, displays and a variety of broad electronics markets, including medical, automotive, industrial and test and measurement applications.On September 23, 2011, the company formally became part of Texas Instruments as the "Silicon Valley" division.
1N4148WS
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
1N4148
Leshan Radio
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
BSS138
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
Cheng-yi Electronic
RC0603FR-0710KL
Yageo
Yageo's RC0603FR-0710KL is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in electronics requiring precise resistance values.
BAV99
Kec
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Intertechnology
1N4148WT
Jiangsu Changjiang Electronics Technology
Bkc Semiconductors
2N2222A
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
M27C1001-15L6
STMicroelectronics
M27C1001-15L6 EPROM by STMicroelectronics features 128KX8 organization, 120 ns access time, and 3-STATE output characteristics. Ideal for industrial applications requiring a memory density of 1048576 bit with a parallel interface.
TMS27C512-25JE4
Texas Instruments
TMS27C512-25JE4 by Texas Instruments is a 64KX8 EPROM with 250 ns access time, 3-STATE output, and operates at -40 to 85 °C. It's used in industrial applications for storing data with a memory density of 524288 bit.
TMS27C512-30JL
TMS27C512-30JL by Texas Instruments is a 64KX8 EPROM with 300 ns access time, operating at 5V. It features 3-STATE output characteristics and uses CMOS technology. Commonly used in commercial applications for parallel data storage due to its 524288 bit memory density.
TMS27C010A-200JE4
TMS27C010A-200JE4 by Texas Instruments is a 128KX8 EPROM with 131072 words, 200 ns access time, and 5V supply voltage. It is used in industrial applications for storing data securely with its CMOS technology and asynchronous operating mode.
TMS27C210A-120JL4
TMS27C210A-120JL4 by Texas Instruments is a 64KX16 EPROM with 120 ns access time, 5V supply voltage, and CMOS technology. Commonly used in commercial applications for storing data due to its 1048576-bit memory density and parallel input/output type.
TMS27C64-25JE4
TMS27C64-25JE4 by Texas Instruments is an 8KX8 EPROM with 250ns access time, 65536-bit memory density, and 5V nominal voltage. It is used in industrial applications for storing data securely with a programming voltage of 12.5V in parallel mode.
NMC27C64Q200
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Maximum Seated Height: 5.969 mm;
5962-8765004LA
5962-8765004LA by STMicroelectronics is a military-grade EPROM with a max temp of 125 °C and operates asynchronously. It features a 5V supply, 2048 words (2Kx8) organization, and offers fast access time of 45 ns. Ideal for reliable data storage in harsh environments.
TMS27C64-20JL4
TMS27C64-20JL4 by Texas Instruments is an 8KX8 EPROM with 70°C max temp, 200 ns access time, and 5.5V max supply voltage. Commonly used in commercial applications for storing data securely due to its UVPROM memory IC type and 65536 bit memory density.
M27C1001-20L3XTR
STMicroelectronics' M27C1001-20L3XTR is a 128Kx8 EPROM chip with 120ns access time, 5V supply voltage, and 32 terminals. Ideal for automotive applications, it features a ceramic package body, common I/O type, and 3-state output characteristics.
AM27C256-150DI
Advanced Micro Devices
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
M27C1001-20L3X
M27C1001-20L3X EPROM by STMicroelectronics features 128Kx8 organization, 120ns max access time, and 5V nominal voltage. Ideal for automotive applications, this CMOS technology memory IC has a memory density of 1048576 bit and operates in parallel mode with a 32-terminal chip carrier package style.
TMS27C240-150JL4
TMS27C240-150JL4 by Texas Instruments is a 256KX16 EPROM with 150 ns access time, operating at 5V. It features a CMOS technology, 3-STATE output characteristics, and supports parallel input/output. Ideal for applications requiring fast memory access in commercial temperature environments.
TMS87C257JE
TMS87C257JE by Texas Instruments is a 32KX8 EPROM with 3-STATE output, operating at -40 to 85 °C. It has a supply voltage of 4.75-5.25V and consumes max 30mA current. Commonly used in industrial applications requiring reliable non-volatile memory storage with fast access time of 250ns.
EPC1PI8
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TMS27C32-150JE4
TMS27C32-150JE4 by Texas Instruments is a 4KX8 EPROM with 150 ns access time, 3-STATE output, and CMOS technology. It operates at -40 to 85 °C, has a supply voltage of 5V, and is used in industrial applications for memory storage due to its 32768 bit density.
Spansion
Spansion's AM27C256-150DI is a 32KX8 EPROM with 262144 bit memory density. It operates at 5V, has a max access time of 150ns, and uses CMOS technology. Ideal for industrial applications requiring reliable non-volatile memory storage in a rectangular ceramic package.
D2764A
Rochester Electronics
D2764A EPROM by Rochester Electronics features 8KX8 organization, 65536 bit memory density, and 250 ns max access time. It is commonly used in applications requiring a 5V nominal voltage, such as commercial-grade MOS technology systems with a need for 3-STATE output characteristics.
5962-8751502JX
5962-8751502JX by STMicroelectronics is a military-grade UVPROM with an asynchronous operating mode and a max access time of 55 ns. It features a ceramic, glass-sealed package with 24 terminals and operates b/w -55 °C to 125 °C. Ideal for reliable data storage in harsh environments, it supports a nominal voltage of 5V.
TMS87C257-150JL
TMS87C257-150JL by Texas Instruments is a 32Kx8 EPROM with 150ns access time and 3-state output. It operates at a voltage of 5V, suitable for commercial applications requiring reliable memory storage in a ceramic package. With 262144 bits memory density, it offers high performance in various electronic devices.
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NMC27C64Q150
National Semiconductor
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP28,.6;
NMC27C64Q250
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
NMC27C16BQ200
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: WDIP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
NMC27C64Q15
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Programming Voltage (V): 13;
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
NMC27C64QE150
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE, WINDOW;
NMC27C64Q25
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS;
NMC27C128BQ200
NMC27C32BQE200
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: WDIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
NMC27C16BQ250
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
NMC27C64QM150
EPROMs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;
NMC27C64QM200
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
NMC27C64QM250
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; JESD-30 Code: R-GDIP-T28;
NMC27C64Q300
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp;
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
NMC27C64QE200
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Technology: CMOS;
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; No. of Words: 8192 words;
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 8192 words;
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
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