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VSC8504XKS-01

Microchip Technology

VSC8504XKS-01 by Microchip Technology

Microchip Technology's VSC8504XKS-01 is an Ethernet transceiver with 256 terminals in a square grid array package. Operating temperature ranges from 0 to 125°C, making it suitable for telecom applications. With a terminal pitch of 1mm and nominal voltage of 1V, it offers high performance in network interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,703 parts In-Stock

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4,703

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Chip Stock

USA . 133 parts In-Stock

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133

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Inventory MP

USA . 2 parts In-Stock

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Bristol Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,177 parts In-Stock

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$7.320

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2,177

$7.320

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AZTECH Wire

Italy . 498 parts In-Stock

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$15.915

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498

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Corohmni

South Africa . 855 parts In-Stock

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$17.239

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855

$17.239

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Ampacity Inc.

Singapore . 480 parts In-Stock

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$403.000

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480

$403.000

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Semicontronic

India . 556 parts In-Stock

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$774.000

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$754.650

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$750.780

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556

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$750.780

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Fulton Briggs Corp.

USA . 7,924 parts In-Stock

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Continental Prestige Electronics

USA . 3,041 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Vigor

Singapore . 1,750 parts In-Stock

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Argo Parts USA

USA . 1,496 parts In-Stock

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Microchip USA

USA . 352 parts In-Stock

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Bastille Electronics

Australia . 23 parts In-Stock

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Overview

Elevate your networking experience with the VSC8504XKS-01 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology ensures top-notch quality and reliability in their products. The VSC8504XKS-01 falls under the category of Network Interfaces, making it an essential component for seamless communication within various systems. With its advanced features and innovative design, this Ethernet transceiver offers unmatched value and benefits to customers. Experience faster data transfer speeds and improved connectivity with the VSC8504XKS-01, setting new standards in network performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various networking applications.

Surface Mount: YES

This surface mount design allows for easy installation and integration into existing systems, saving time and effort.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it space-efficient for crowded circuit board layouts.

No. of Terminals: 256

With 256 terminals, this network interface can handle a high volume of data transfer, making it suitable for demanding networking tasks.

Package Style (Meter): GRID ARRAY

The grid array package style offers high electrical performance and reliability, ensuring consistent connectivity in critical networking environments.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows this product to function reliably even in extreme conditions, making it a dependable choice for industrial settings.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that this network interface can operate efficiently in a wide range of environments, from freezing cold to scorching heat.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy connection to other components, simplifying the overall assembly process.

Maximum Seated Height: 1.8 mm

The low maximum seated height enables this product to be used in compact devices with tight space constraints.

Width: 17 mm

With a width of 17mm, this network interface can fit comfortably within standard circuit board dimensions, ensuring compatibility with a range of devices.

Length: 17 mm

The 17mm length of this product further adds to its space-saving design, making it an efficient choice for compact networking solutions.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections, reducing the chance of signal loss or interruptions during data transmission.

Telecom IC Type: ETHERNET TRANSCEIVER

The use of Ethernet transceiver technology ensures high-speed data transfer and low latency, making this product an excellent choice for network applications requiring fast and dependable connectivity.

Nominal Supply Voltage: 1 V

The low nominal supply voltage of 1V helps to minimize power consumption, making this product energy-efficient and cost-effective.

Terminal Pitch: 1 mm

The 1mm terminal pitch allows for easy connection to other components on the circuit board, simplifying the overall design and assembly process.

Technical Specifications

Network Interfaces VSC8504XKS-01 attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

No. of Functions:

1

No. of Terminals:

256

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

1.8 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Trade Compliance

VSC8504XKS-01 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.01

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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