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USB5906C-I/KD

Microchip Technology

USB5906C-I/KD by Microchip Technology

USB5906C-I/KD by Microchip Tech is a BUS CONTROLLER with 625 MBps data rate, 25 MHz clock freq, and 1.08-1.32 V supply range. Ideal for I2C, SMBUS, SPI, UART & USB bus compatibility in industrial applications due to its compact size (12x12 mm) and low profile (0.9 mm).

Median Price

$9.810

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 196 parts In-Stock

1+ parts

$9.810

100+ parts

$7.900

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196

$9.810

$7.900

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DigiKey

USA . 156 parts In-Stock

1+ parts

$9.810

100+ parts

$7.900

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156

$9.810

$7.900

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$9.849

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300

$9.849

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Vyrian

USA . 6,032 parts In-Stock

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6,032

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 336 parts In-Stock

1+ parts

$9.720

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336

$9.720

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Netroflash

USA . 50 parts In-Stock

1+ parts

$9.849

100+ parts

$9.652

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50

$9.849

$9.652

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Corohmni

South Africa . 42 parts In-Stock

1+ parts

$55.481

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42

$55.481

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QualityLine Systems

Poland . 6,385 parts In-Stock

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6,385

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Marpe Global Electronics

Taiwan . 3,274 parts In-Stock

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XL Components Corporation

Australia . 477 parts In-Stock

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477

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Overview

Discover the power of seamless connectivity with the USB5906C-I/KD by Microchip Technology. As a leader in bus controllers, Microchip Technology brings unparalleled quality and reliability to your projects. Whether you're working on industrial automation, IoT devices, or consumer electronics, this versatile chip carrier offers lightning-fast data transfer rates of up to 625 MBps. With a slim profile and robust construction, the USB5906C-I/KD is the perfect solution for all your USB, I2C, SMBUS, SPI, and UART needs. Elevate your designs with Microchip Technology and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in portable or rugged applications.

Surface Mount: YES

Surface mount compatibility enables easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power input options and ensures stable performance under varying voltage conditions.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board and easy alignment during assembly.

No. of Terminals: 100

The high number of terminals provides extensive connectivity options, allowing for versatile integration with other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and compact design for improved system performance.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in harsh environments or under heavy usage.

Maximum Data Transfer Rate: 625 MBps

The high data transfer rate enables fast communication between devices, improving overall system efficiency and performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in cold environments without compromising performance.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections, reducing the risk of signal interference or disconnection.

Maximum Seated Height: 0.9 mm

The low maximum seated height allows for compact and slim designs, making the product suitable for space-constrained applications.

Width: 12 mm

The moderate width provides a good balance between size and functionality, allowing for easy integration into different types of systems.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency ensures fast and efficient data processing, enhancing the overall performance of the product.

Length: 12 mm

The moderate length offers flexibility in placement within the system and efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments, making the product suitable for a wide range of applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

The inclusion of bus controller and USB technology provides versatile connectivity options and compatibility with a variety of devices, enhancing the product's functionality.

Technology: CMOS

The use of CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation of the product.

Terminal Form: NO LEAD

The no-lead terminal form simplifies assembly processes and enhances reliability by reducing the risk of solder joint failures.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable operating condition for the product, ensuring consistent performance and compatibility with standard power sources.

Bus Compatibility: I2C; SMBUS; SPI; UART; USB

The compatibility with multiple bus interfaces allows for seamless integration with various systems and devices, enhancing the product's versatility and usability.

Terminal Pitch: 0.4 mm

The small terminal pitch enables high-density mounting and efficient use of space on the circuit board, making the product well-suited for compact designs.

Technical Specifications

Bus Controllers USB5906C-I/KD attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES WITH 3.3V SUPPLY

Bus Compatibility:

I2C; SMBUS; SPI; UART; USB

Maximum Clock Frequency:

25 MHz

Maximum Data Transfer Rate:

625 MBps

JESD-30 Code:

S-PQCC-N100

Length:

12 mm

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC100,.47SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

USB5906C-I/KD Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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