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SY10EL31ZCTR

Microchip Technology

SY10EL31ZCTR by Microchip Technology

SY10EL31ZCTR by Microchip Technology is a ECL technology latch with 0.59 ns propagation delay, -5.2V nominal voltage, and 2200 MHz min fmax. It is used in applications requiring fast signal processing such as high-speed data communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,369 parts In-Stock

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1,369

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 697 parts In-Stock

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$10.193

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697

$10.193

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Fulton Briggs Corp.

USA . 2,636 parts In-Stock

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Argo Parts USA

USA . 1,768 parts In-Stock

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Microchip USA

USA . 1,138 parts In-Stock

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Continental Prestige Electronics

USA . 897 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Elevate your electronic designs with the SY10EL31ZCTR by Microchip Technology, a premier manufacturer known for superior quality and reliability. As a leading product in the Latches & Flip-Flops category, this component offers lightning-fast 0.59 ns propagation delay, ensuring optimal performance in high-speed applications. With its compact design and versatile features, this product is ideal for a wide range of industries. Experience the value and benefits of Microchip's SY10EL31ZCTR, where precision meets innovation for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the latch or flip-flop, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 0.59 ns

Fast propagation delay ensures quick switching and response times, making this latch or flip-flop ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on a circuit board, saving space and reducing assembly time.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures reliable and accurate operation of the latch or flip-flop in digital circuits, reducing the risk of errors.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making this latch or flip-flop efficient and suitable for demanding applications.

Technical Specifications

Latches & Flip-Flops SY10EL31ZCTR attributes and parameters. Explore more Latches & Flip-Flops devices from Microchip Technology

Specs

Family:

10EL

JESD-30 Code:

R-PDSO-G8

Length:

4.93 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Maximum Power Supply Current (ICC):

32 mA

Propagation Delay At Nominal Supply:

.59 ns

Propagation Delay (tpd):

.59 ns

Maximum Seated Height:

1.73 mm

Maximum Supply Voltage (Vsup):

-5.5 V

Minimum Supply Voltage (Vsup):

-4.75 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.94 mm

Minimum fmax:

2200 MHz

Trade Compliance

SY10EL31ZCTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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