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SY10EL31ZGTR

Microchip Technology

SY10EL31ZGTR by Microchip Technology

D FLIP-FLOP; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Packing Method: TR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10,000

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$27.363

100+ parts

$24.900

1k+ parts

$22.438

10k+ parts

-

500

$27.363

$24.900

$22.438

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Component Stockers USA

USA . 560 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

560

$99.990

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 19,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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19,615

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-

-

-

Montano Global Distributors

Canada . 7,588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,588

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-

-

-

LOOK Integrated Logistics

Peru . 6,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,038

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-

-

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LMD Electronica

Estonia . 5,003 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,003

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-

-

-

Microchip USA

USA . 4,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,624

-

-

-

-

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,500

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-

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NIA Electronics

USA . 1,887 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,887

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Ledger Components

France . 1,887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,887

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-

-

-

Kepictronics

USA . 370 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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370

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Technical Specifications

Latches & Flip-Flops SY10EL31ZGTR attributes and parameters. Explore more Latches & Flip-Flops devices from Microchip Technology

Specs

Family:

10EL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.93 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Propagation Delay (tpd):

.59 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Surface Mount:

YES

Technology:

ECL

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.94 mm

Minimum fmax:

2200 MHz

Trade Compliance

SY10EL31ZGTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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