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SY100EL51ZI

Microchip Technology

SY100EL51ZI by Microchip Technology

SY100EL51ZI by Microchip Technology is a high-speed ECL flip-flop with a propagation delay of 0.565 ns, ideal for applications requiring fast data processing. This small outline IC has 8 terminals and operates at a max frequency of 2200 MHz, making it suitable for advanced electronic systems where speed and precision are crucial. The positive edge trigger type and complementary output polarity enhance its performance in demanding circuit designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 158 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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158

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-

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Nova Conductors

Japan . 71 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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71

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 733 parts In-Stock

1+ parts

$10.794

100+ parts

-

1k+ parts

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10k+ parts

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733

$10.794

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Ampacity Inc.

Singapore . 1,280 parts In-Stock

1+ parts

$34.000

100+ parts

-

1k+ parts

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10k+ parts

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1,280

$34.000

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Argo Parts USA

USA . 4,589 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,589

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Fulton Briggs Corp.

USA . 2,119 parts In-Stock

1+ parts

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2,119

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-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Microchip USA

USA . 1,871 parts In-Stock

1+ parts

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1,871

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Continental Prestige Electronics

USA . 627 parts In-Stock

1+ parts

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1k+ parts

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627

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Overview

Elevate your electronic designs with the SY100EL51ZI by Microchip Technology. Known for their top-quality components, Microchip Technology delivers excellence in every product. This latches & flip-flops device offers unparalleled speed and reliability, making it ideal for high-performance applications. With a sleek small outline package and dual terminal position, this component is versatile and easy to integrate into any project. Experience the benefits of fast propagation delay and a high maximum fmax of 2200 MHz. Upgrade your designs today with the SY100EL51ZI and see the difference Microchip Technology can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protects the internal components of the latch or flip-flop.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular package shape provides compatibility with standard PCB layouts and facilitates easy placement on the board.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options, making it suitable for a variety of circuit configurations.

Propagation Delay (tpd): 0.565 ns

The low propagation delay ensures fast and efficient operation of the latch or flip-flop, making it suitable for high-speed applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise and reliable transitioning, suitable for applications requiring accurate timing control.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and allows for better signal routing, improving overall performance.

Maximum Seated Height: 1.73 mm

The low maximum seated height enables compact and space-efficient designs, ideal for applications with size constraints.

Width: 3.94 mm

The compact width of 3.94 mm allows for efficient use of PCB real estate, enabling dense circuit layouts and saving space.

Output Polarity: COMPLEMENTARY

Complementary output polarity provides a balanced signal output, minimizing noise and enhancing signal integrity in the circuit.

Length: 4.93 mm

The moderate length of 4.93 mm offers a good balance between compactness and ease of handling during installation and maintenance.

Technology: ECL

The ECL technology offers high-speed operation and low power consumption, making it suitable for applications requiring efficient performance.

Terminal Form: GULL WING

The gull wing terminal form provides reliable solder connections and easy inspection, ensuring robust electrical connections in the circuit.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for close placement of terminals on the PCB, enhancing signal integrity and reducing interference.

Minimum fmax: 2200 MHz

The high minimum fmax of 2200 MHz ensures compatibility with high-frequency applications, making it suitable for demanding signal processing tasks.

Technical Specifications

Latches & Flip-Flops SY100EL51ZI attributes and parameters. Explore more Latches & Flip-Flops devices from Microchip Technology

Specs

Additional Features:

WITH DIFFERENTIAL CLOCK

Family:

100EL

JESD-30 Code:

R-PDSO-G8

Length:

4.93 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

.565 ns

Maximum Seated Height:

1.73 mm

Surface Mount:

YES

Technology:

ECL

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.94 mm

Minimum fmax:

2200 MHz

Trade Compliance

SY100EL51ZI Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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