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SY100EL31ZG

Microchip Technology

SY100EL31ZG by Microchip Technology

SY100EL31ZG by Microchip Technology is a small outline latch with 0.645 ns propagation delay, ideal for industrial applications. With 8 terminals and operating temperature range of -40 to 85 °C, it offers complementary output polarity and positive edge trigger type. This ECL technology device has a max fmax of 2200 MHz and requires 37 mA power supply current.

Median Price

$2.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 723 parts In-Stock

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-

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$2.950

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$2.540

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723

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$2.950

$2.540

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Master Electronics

USA . 623 parts In-Stock

1+ parts

-

100+ parts

$2.500

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$2.200

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623

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$2.200

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Verical

USA . 20 parts In-Stock

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$3.143

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20

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$3.143

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Distributors (In-Stock)

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Vyrian

USA . 436 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 117 parts In-Stock

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117

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Benley Electronics

USA . 1 parts In-Stock

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$1.750

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1

$1.750

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Ampacity Inc.

Singapore . 206 parts In-Stock

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$2.130

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206

$2.130

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Aztec Data Supply Inc.

USA . 216 parts In-Stock

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$11.654

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216

$11.654

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Corohmni

South Africa . 158 parts In-Stock

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$15.438

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158

$15.438

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RGB Technical Solutions

Ukraine . 5,828 parts In-Stock

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Microchip USA

USA . 5,253 parts In-Stock

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Argo Parts USA

USA . 1,177 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Perfect Parts

USA . 222 parts In-Stock

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Continental Prestige Electronics

USA . 149 parts In-Stock

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Authorized Procurement Solutions

USA . 117 parts In-Stock

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Overview

Experience seamless performance and reliability with the Microchip Technology SY100EL31ZG latch flip-flop. Crafted with precision and expertise, this product offers unparalleled quality and durability. Ideal for a wide range of applications in the latches & flip-flops category, this innovative solution delivers exceptional value and benefits to customers. Trust Microchip Technology to provide you with cutting-edge technology that enhances your systems and operations. Unlock new possibilities with the SY100EL31ZG and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making the latch reliable in various conditions.

Surface Mount: YES

The surface mount capability allows for easy installation and frees up space on the circuit board, making it suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular shape offers a standardized form factor that is compatible with a wide range of applications and circuit designs.

No. of Terminals: 8

Having 8 terminals allows for more connectivity options and flexibility in circuit design, accommodating various input and output needs.

Propagation Delay (tpd): 0.645 ns

The low propagation delay ensures fast and efficient operation, making the latch suitable for high-speed applications that require quick switching.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the latch can handle elevated heat levels without compromising performance, ensuring reliability in harsh environments.

Trigger Type: POSITIVE EDGE

The positive edge trigger type allows for precise control and synchronization of signals, making the latch ideal for applications that require accurate timing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the latch can function effectively in cold conditions, increasing its versatility in a wide range of environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and durability of the latch.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in installation and connectivity options, accommodating different circuit layouts and requirements.

Maximum Seated Height: 1.73 mm

The low maximum seated height allows for a compact overall design, making the latch suitable for applications where space is limited or height constraints exist.

Width: 3.94 mm

The narrow width of the latch enables efficient use of space on the circuit board, allowing for dense packing of components and optimizing layout design.

Output Polarity: COMPLEMENTARY

The complementary output polarity provides balanced and complementary signals, facilitating reliable operation and compatibility with various signal processing circuits.

Length: 4.93 mm

The moderate length of the latch offers a good balance between compactness and functionality, making it suitable for a variety of circuit board layouts and designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the latch can withstand demanding industrial environments and operate reliably in a wide range of temperature conditions.

Technology: ECL

The use of ECL technology offers high-speed operation and low power consumption, making the latch energy-efficient and suitable for high-speed applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during installation, ensuring secure and reliable connections on the circuit board.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise alignment and spacing of terminals, enabling efficient installation and minimizing the risk of short circuits.

Minimum fmax: 2200 MHz

With a high minimum fmax value, the latch can operate at frequencies up to 2200 MHz, making it suitable for high-frequency applications that require rapid signal processing.

Moisture Sensitivity Level (MSL): 3

The MSL level 3 indicates that the latch is less sensitive to moisture, making it more robust and reliable in humid or damp environments.

Maximum Power Supply Current (ICC): 37 mA

The maximum power supply current of 37 mA allows for efficient power management and ensures that the latch operates within the specified current limits, preventing overheating or damage.

Technical Specifications

Latches & Flip-Flops SY100EL31ZG attributes and parameters. Explore more Latches & Flip-Flops devices from Microchip Technology

Specs

Family:

100EL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.93 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

TSSOP8,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

37 mA

Propagation Delay (tpd):

.645 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.94 mm

Minimum fmax:

2200 MHz

Trade Compliance

SY100EL31ZG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-589-6821, 5962015896821

NIIN

015896821

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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