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SST39VF3201C-70-4I-B3KE-T-VAO

Microchip Technology

SST39VF3201C-70-4I-B3KE-T-VAO by Microchip Technology

SST39VF3201C-70-4I-B3KE-T-VAO by Microchip: 2MX16 NOR Flash Memory, 3V, -40 to 85°C, AEC-Q100 for industrial applications. Features 8 sectors of sizes 4K and 32K words with a max access time of 70ns. Offers common flash interface, endurance of 100k cycles, and operates in asynchronous mode.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,813 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Ampacity Inc.

Singapore . 1,306 parts In-Stock

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$3.000

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Aztec Data Supply Inc.

USA . 3,482 parts In-Stock

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Corohmni

South Africa . 679 parts In-Stock

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AZTECH Wire

Italy . 357 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,258 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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RGB Technical Solutions

Ukraine . 3,289 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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Bastille Electronics

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Overview

Unlock the power of reliable and high-quality flash memory with the SST39VF3201C-70-4I-B3KE-T-VAO by Microchip Technology. Designed for industrial applications, this NOR type memory offers a robust solution with 100,000 write/erase cycles and a wide operating temperature range. With a compact design and 2Mx16 organization, this flash memory is perfect for demanding environments where data integrity and fast access times are essential. Trust in Microchip Technology's expertise and elevate your systems with the SST39VF3201C-70-4I-B3KE-T-VAO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the flash memory chip, ensuring a long lifespan and reliable performance.

Surface Mount: YES

Allows for easy installation on circuit boards, making integration into electronic devices simple and efficient.

Operating Mode: ASYNCHRONOUS

Enables the flash memory to operate independently of the system clock, improving flexibility and efficiency in data storage and retrieval.

Nominal Supply Voltage / Vsup (V): 3

Suitable voltage level for stable and efficient operation of the flash memory chip.

No. of Words: 2097152 words

Large memory capacity allows for storing a significant amount of data, making it suitable for a wide range of applications and usage scenarios.

Endurance: 100000 Write/Erase Cycles

High endurance rating ensures durability and longevity, making the flash memory chip a reliable choice for frequent read/write operations.

Technical Specifications

Flash Memory SST39VF3201C-70-4I-B3KE-T-VAO attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Access Time:

70 ns

Additional Features:

BOTTOM BOOT BLOCK

Boot Block:

BOTTOM

Common Flash Interface:

YES

Data Polling:

YES

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B48

Length:

8 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Sectors/Size:

8,63

No. of Terminals:

48

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3

Ready or Busy:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sector Size (Words):

4K,32K

Maximum Standby Current:

.00005 Amp

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Toggle Bit:

YES

Type:

NOR TYPE

Width:

6 mm

Trade Compliance

SST39VF3201C-70-4I-B3KE-T-VAO Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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