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SST26WF016BAT-104I/SN

Microchip Technology

SST26WF016BAT-104I/SN by Microchip Technology

SST26WF016BAT-104I/SN by Microchip: 16MX1 NOR Flash Memory, 104 MHz clock frequency, SPI serial bus type. Ideal for industrial applications requiring high endurance with 100K write/erase cycles and operating temperature range of -40 to 85°C.

Median Price

$2.440

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$2.440

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150

$2.440

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Vyrian

USA . 5,330 parts In-Stock

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5,330

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Chip Stock

USA . 2,800 parts In-Stock

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2,800

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$2.391

100+ parts

-

1k+ parts

$2.296

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100

$2.391

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$2.296

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Argo Parts USA

USA . 4,265 parts In-Stock

1+ parts

$2.440

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4,265

$2.440

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Continental Prestige Electronics

USA . 3,732 parts In-Stock

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$2.440

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$2.391

3,732

$2.440

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$2.391

AZTECH Wire

Italy . 404 parts In-Stock

1+ parts

$11.763

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404

$11.763

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Ampacity Inc.

Singapore . 280 parts In-Stock

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$13.000

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280

$13.000

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QUARKTWIN TECHNOLOGY LTD

USA . 14,368 parts In-Stock

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Microchip USA

USA . 5,941 parts In-Stock

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RGB Technical Solutions

Ukraine . 4,338 parts In-Stock

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4,338

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S.R.D Solutions

India . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Elevate your electronics with the SST26WF016BAT-104I/SN from Microchip Technology. This high-quality Flash Memory device offers a seamless blend of reliability, performance, and versatility. Ideal for industrial applications, this product provides 16MX1 organization, 100000 Write/Erase cycles endurance, and a wide operating temperature range. With its compact design and SPI Serial Bus Type, it's the perfect solution for your memory needs. Trust Microchip Technology to deliver superior products that exceed expectations. Unlock the potential of your devices with the SST26WF016BAT-104I/SN.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the flash memory, making it a reliable choice for long-term use.

Surface Mount:

YES - The surface mount feature allows for easy and convenient installation in various electronic devices.

Screening Level:

TS 16949 - This screening level ensures high quality and reliability of the flash memory, making it suitable for automotive applications.

Package Shape:

RECTANGULAR - The rectangular shape of the package allows for efficient use of space in electronic devices.

Operating Mode:

SYNCHRONOUS - The synchronous operation mode offers fast and efficient data transfer, enhancing overall performance.

Nominal Supply Voltage (Vsup):

1.8V - The low nominal supply voltage helps in reducing power consumption, making it energy-efficient.

No. of Terminals:

8 - The limited number of terminals simplifies installation and reduces the chances of errors during setup.

Package Style (Meter):

SMALL OUTLINE - The small outline package style makes it suitable for compact electronic devices with limited space.

Maximum Operating Temperature:

85 °C - The high maximum operating temperature ensures reliability even in harsh environmental conditions.

Organization:

16MX1 - The organization of 16MX1 offers optimal memory organization for efficient data storage and retrieval.

Output Characteristics:

3-STATE - The 3-STATE output characteristics provide flexibility in controlling the data output, enhancing compatibility with various systems.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature allows for reliable performance in extreme cold environments.

Terminal Finish:

MATTE TIN - The matte tin terminal finish provides corrosion resistance and ensures long-term reliability of the flash memory.

Terminal Position:

DUAL - The dual terminal position allows for easier connection and installation in various electronic devices.

Write Protection:

HARDWARE/SOFTWARE - The write protection feature ensures data security and integrity, making it a secure choice for storing sensitive information.

Maximum Seated Height:

1.75 mm - The low maximum seated height allows for easy integration in slim electronic devices without compromising on performance.

Maximum Clock Frequency (fCLK):

104 MHz - The high maximum clock frequency enables fast data transfer and processing speeds, improving overall performance.

Width:

3.9 mm - The compact width of the flash memory makes it suitable for small electronic devices with limited space.

Minimum Supply Voltage (Vsup):

1.65V - The low minimum supply voltage helps in reducing power consumption and extending the battery life of electronic devices.

Maximum Time At Peak Reflow Temperature:

40s - The short time at peak reflow temperature ensures that the flash memory remains stable and reliable during the manufacturing process.

Peak Reflow Temperature:

260 °C - The high peak reflow temperature ensures proper soldering and bonding, enhancing the durability of the flash memory.

Type:

NOR TYPE - The NOR type flash memory offers fast read speeds and random access, making it suitable for applications requiring quick data retrieval.

Length:

4.9 mm - The compact length of the flash memory allows for easy integration in electronic devices with limited space.

Programming Voltage (V):

1.8V - The low programming voltage simplifies the programming process and reduces power consumption.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade makes the flash memory suitable for applications in harsh industrial environments.

Technology:

CMOS - The CMOS technology used in the flash memory ensures low power consumption and high reliability.

Parallel or Serial:

SERIAL - The serial interface allows for efficient and reliable data transfer, making it suitable for various electronic devices.

Terminal Form:

GULL WING - The gull wing terminal form offers secure connections and easy installation, enhancing the overall reliability of the flash memory.

Maximum Supply Current:

25 mA - The low maximum supply current helps in reducing power consumption, making it energy-efficient.

No. of Words:

16777216 words - The high number of words capacity enables storage of large amounts of data, making it suitable for applications requiring extensive memory.

Minimum Data Retention Time:

100 - The long minimum data retention time ensures data integrity and reliability even during long periods of inactivity.

Terminal Pitch:

1.27 mm - The small terminal pitch allows for compact design and efficient use of space in electronic devices.

No. of Words Code:

16M - The words code of 16M indicates the large memory capacity of the flash memory, making it suitable for data-intensive applications.

Moisture Sensitivity Level (MSL):

3 - The moisture sensitivity level of 3 ensures that the flash memory remains stable and reliable even in humid conditions.

Maximum Supply Voltage (Vsup):

1.95V - The high maximum supply voltage tolerance provides flexibility in power supply options for the flash memory.

Endurance:

100000 Write/Erase Cycles - The high endurance rating ensures long-lasting performance and reliability during frequent write and erase operations.

Serial Bus Type:

SPI - The SPI serial bus type offers fast data transfer rates and reliable communication, making it suitable for high-performance applications.

Memory Density:

16777216 bit - The high memory density allows for storage of large amounts of data in a compact form factor, making it suitable for memory-intensive applications.

Memory IC Type:

FLASH - The flash memory IC type offers non-volatile storage and fast data access, making it suitable for applications requiring instant data retrieval.

Maximum Standby Current:

0.000005 Amp - The low maximum standby current helps in reducing power consumption during idle periods, extending the battery life of electronic devices.

Technical Specifications

Flash Memory SST26WF016BAT-104I/SN attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

1.8

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000005 Amp

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Type:

NOR TYPE

Width:

3.9 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

SST26WF016BAT-104I/SN Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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