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RN131G-I/RM475

Microchip Technology

RN131G-I/RM475 by Microchip Technology

Microchip Technology's RN131G-I/RM475 is a surface mount network interface with 44 terminals. It operates b/w -30°C to 85°C, with a seated height of 3.5mm and terminal pitch of 2mm. Ideal for LAN switching circuits, it has a nominal voltage of 3.3V in a compact rectangular package style.

Median Price

$49.440

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 35 parts In-Stock

1+ parts

$49.440

100+ parts

$45.212

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35

$49.440

$45.212

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$43.650

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50

$43.650

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Vyrian

USA . 3,719 parts In-Stock

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3,719

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Chip Stock

USA . 640 parts In-Stock

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640

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Distributors (Availability)

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AZTECH Wire

Italy . 533 parts In-Stock

1+ parts

$9.525

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533

$9.525

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$15.675

100+ parts

$14.264

1k+ parts

$12.854

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2,000

$15.675

$14.264

$12.854

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Ampacity Inc.

Singapore . 43 parts In-Stock

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$42.020

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43

$42.020

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Netroflash

USA . 500 parts In-Stock

1+ parts

$43.650

100+ parts

$42.777

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500

$43.650

$42.777

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Lixinc

USA . 17,623 parts In-Stock

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17,623

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RGB Technical Solutions

Ukraine . 3,607 parts In-Stock

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3,607

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Overview

Unlock seamless connectivity with the RN131G-I/RM475 by Microchip Technology. Crafted with precision and quality, this network interface module guarantees reliable performance in a compact rectangular package. Ideal for a wide range of applications, this LAN switching circuit offers unparalleled value, ensuring smooth communication and data transfer. Experience the benefits of Microchip Technology's expertise with the RN131G-I/RM475 and elevate your connectivity solutions today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting on the surface of a PCB, making it efficient for production and assembly processes.

No. of Terminals: 44

Provides ample connections for various networking applications, offering flexibility in network configurations.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, making it suitable for industrial use.

Nominal Supply Voltage: 3.3 V

Operates at a standard voltage level, ensuring compatibility with common power sources.

Technical Specifications

Network Interfaces RN131G-I/RM475 attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N44

Length:

37 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

3.5 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2 mm

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Trade Compliance

RN131G-I/RM475 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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