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RN131G-I/RM475PSW

Microchip Technology

RN131G-I/RM475PSW by Microchip Technology

Microchip Technology's RN131G-I/RM475PSW is a wireless LAN circuit with 44 terminals in a rectangular package. Operating temperature ranges from -30 to 85°C, suitable for various applications. With a terminal pitch of 2mm and hybrid technology, it offers reliable network interfaces in compact microelectronic assembly.

Median Price

$36.230

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$36.230

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44

$36.230

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Vyrian

USA . 588 parts In-Stock

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588

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 293 parts In-Stock

1+ parts

$19.140

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293

$19.140

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Netroflash

USA . 100 parts In-Stock

1+ parts

$36.230

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100

$36.230

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Ampacity Inc.

Singapore . 1,271 parts In-Stock

1+ parts

$759.000

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1,271

$759.000

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LMD Electronica

Estonia . 8,051 parts In-Stock

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8,051

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Montano Global Distributors

Canada . 7,074 parts In-Stock

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7,074

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NIA Electronics

USA . 6,886 parts In-Stock

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6,886

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Ledger Components

France . 6,886 parts In-Stock

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6,886

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LOOK Integrated Logistics

Peru . 2,193 parts In-Stock

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2,193

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Experience seamless connectivity with the RN131G-I/RM475PSW by Microchip Technology, a leading manufacturer in the Network Interfaces category. This innovative product offers reliable wireless LAN circuitry in a compact and durable package, perfect for a wide range of applications. With a wide operating temperature range and easy surface mount installation, this device provides exceptional value and performance to customers looking for high-quality networking solutions. Stay connected effortlessly with Microchip Technology's RN131G-I/RM475PSW.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and convenient installation on circuit boards, making it a time-saving and cost-effective choice.

Package Shape: RECTANGULAR

The rectangular shape offers compatibility with standard board layouts, making it a versatile option for various applications.

No. of Terminals: 44

With a high number of terminals, this product provides ample connectivity options for complex networking systems.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style ensures efficient assembly and integration into electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature ensures the product can function in a wide range of temperature environments.

Terminal Position: QUAD

The quad terminal position offers stability and durability, enhancing the product's overall reliability.

Maximum Seated Height: 3.5 mm

The low profile design with a maximum seated height of 3.5 mm allows for compact and space-saving installations.

Width: 20 mm

The 20 mm width provides a balance between size and functionality, making it suitable for various networking setups.

Length: 37 mm

With a length of 37 mm, this product offers sufficient space for terminals and components without being overly bulky.

Technology: HYBRID

The hybrid technology combines the best of different technologies, ensuring optimal performance and efficiency.

Terminal Form: NO LEAD

The no lead terminal form reduces the risk of soldering errors and improves the overall reliability of the product.

Telecom IC Type: WIRELESS LAN CIRCUIT

This telecom IC type allows for seamless wireless connectivity, making it ideal for networking applications.

Nominal Supply Voltage: 3.3 V

The 3.3 V supply voltage is a standard and widely supported voltage level, ensuring compatibility with various systems.

Terminal Pitch: 2 mm

With a terminal pitch of 2 mm, this product offers easy connectivity and integration into existing circuit layouts.

Technical Specifications

Network Interfaces RN131G-I/RM475PSW attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

R-XQMA-N44

Length:

37 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

3.5 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

HYBRID

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

RN131G-I/RM475PSW Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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