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MSCSM120HM16CT3AG

Microchip Technology

MSCSM120HM16CT3AG by Microchip Technology

MSCSM120HM16CT3AG by Microchip is an N-CHANNEL FET with 1200V DS breakdown voltage, ideal for switching applications. Featuring a bridge configuration with 4 elements, built-in diode and thermistor, it operates in enhancement mode. With a max pulsed drain current of 350A and max power dissipation of 745W, this MOSFET is designed for high-power requirements.

Median Price

$490.578

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 2 parts In-Stock

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$490.578

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Vyrian

USA . 7,233 parts In-Stock

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Nova Conductors

Japan . 81 parts In-Stock

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Ampacity Inc.

Singapore . 2 parts In-Stock

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$416.990

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Microchip USA

USA . 2,912 parts In-Stock

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$550.649

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RGB Technical Solutions

Ukraine . 5,557 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Upgrade your power systems with the MSCSM120HM16CT3AG by Microchip Technology, a top-quality N-CHANNEL Power Field Effect Transistor. With a built-in diode and thermistor, this transistor is perfect for switching applications. Offering a high DS Breakdown Voltage of 1200V and a maximum Pulsed Drain Current of 350A, this product ensures reliable performance and efficiency. Trust in the expertise of Microchip Technology to deliver innovative solutions that meet your power needs. Experience the benefits of enhanced power management and seamless operation with the MSCSM120HM16CT3AG.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are suitable for high power applications and have lower conduction losses.

Configuration: BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The bridge configuration with built-in diode and thermistor provides enhanced functionality and protection in circuit designs.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring efficient and reliable performance.

Minimum DS Breakdown Voltage: 1200 V

High breakdown voltage allows for handling higher power levels and ensures safe operation in high voltage circuits.

Maximum Pulsed Drain Current (IDM): 350 A

Capable of handling high pulsed currents, making it suitable for applications requiring brief periods of high power.

Maximum Power Dissipation (Abs): 745 W

High power dissipation rating enables the FET to handle large amounts of power without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low gate drive requirements, enhancing overall efficiency.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows for operation in various environmental conditions.

Transistor Element Material: SILICON CARBIDE

Silicon carbide material provides high temperature performance, great thermal conductivity, and high breakdown voltage.

Maximum Drain-Source On Resistance: 0.016 ohm

Low on-resistance results in reduced power losses and improved efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) MSCSM120HM16CT3AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

173 A

Maximum Drain Current (ID):

173 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XUFM-X25

No. of Elements:

4

No. of Terminals:

25

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

350 A

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

MSCSM120HM16CT3AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.50.00.80

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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