Loading...

MSCSM120DAM11CT3AG

Microchip Technology

MSCSM120DAM11CT3AG by Microchip Technology

MSCSM120DAM11CT3AG by Microchip is a N-CHANNEL FET with 1200V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and thermistor, operating in enhancement mode. With a max IDM of 500A and ID of 254A, this MOSFET has a 0.0104 ohm drain-source on resistance.

Median Price

$181.310

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4 parts In-Stock

1+ parts

$181.310

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$181.310

-

-

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$181.310

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$181.310

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 2 parts In-Stock

1+ parts

$207.210

100+ parts

$190.860

1k+ parts

$176.890

10k+ parts

-

2

$207.210

$190.860

$176.890

-

Vyrian

USA . 2,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,120

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4 parts In-Stock

1+ parts

$195.460

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$195.460

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 17,581 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,581

-

-

-

-

Microchip USA

USA . 11,718 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,718

-

-

-

-

QualityLine Systems

Poland . 7,401 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,401

-

-

-

-

Marpe Global Electronics

Taiwan . 6,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,592

-

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

XL Components Corporation

Australia . 164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

164

-

-

-

-

Overview

Upgrade your power systems with the MSCSM120DAM11CT3AG Power Field Effect Transistor by Microchip Technology. Designed for enhanced performance, this N-CHANNEL transistor offers a built-in diode and thermistor for added convenience. Ideal for switching applications, this product provides a maximum pulsing drain current of 500A and a minimum DS breakdown voltage of 1200V. With a maximum power dissipation of 1067W and operating temperature range from -40 to 175°C, this transistor ensures reliability and durability. Trust in Microchip Technology's expertise and revolutionize your power solutions today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in high-power applications due to their lower ON resistance and higher efficiency.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage, this FET can handle high voltage applications with ease, ensuring reliable operation.

Maximum Pulsed Drain Current (IDM): 500 A

The high pulsed drain current rating allows for short bursts of high power, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 1067 W

The high power dissipation capability ensures that the FET can handle high power levels without overheating.

Technical Specifications

Power Field Effect Transistors (FET) MSCSM120DAM11CT3AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

254 A

Maximum Drain Current (ID):

254 A

Maximum Drain-Source On Resistance:

.0104 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XUFM-X25

No. of Elements:

1

No. of Terminals:

25

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

500 A

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

MSCSM120DAM11CT3AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.50.00.80

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20