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MSC080SMA330B4

Microchip Technology

MSC080SMA330B4 by Microchip Technology

MSC080SMA330B4 by Microchip is a N-CHANNEL FET with 3300V DS breakdown voltage, ideal for switching applications. It features a max IDM of 100A and 0.105 ohm RDS(on), operating in enhancement mode. With a package style of FLANGE MOUNT, it can handle up to 381W power dissipation at temperatures ranging from -55 to 150 °C.

Median Price

$142.870

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 30 parts In-Stock

1+ parts

$142.541

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30

$142.541

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Master Electronics

USA . 20 parts In-Stock

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$142.870

100+ parts

$130.550

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20

$142.870

$130.550

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Verical

USA . 20 parts In-Stock

1+ parts

$185.731

100+ parts

$169.715

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-

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20

$185.731

$169.715

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$104.658

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100

$104.658

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Vyrian

USA . 8,029 parts In-Stock

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8,029

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 870 parts In-Stock

1+ parts

$7.588

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870

$7.588

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Ampacity Inc.

Singapore . 53 parts In-Stock

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$92.220

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53

$92.220

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$104.658

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$99.425

10k+ parts

$97.332

2,000

$104.658

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$99.425

$97.332

Continental Prestige Electronics

USA . 11 parts In-Stock

1+ parts

$111.800

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11

$111.800

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Microchip USA

USA . 3,121 parts In-Stock

1+ parts

$207.090

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3,121

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NIA Electronics

USA . 8,366 parts In-Stock

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8,366

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Ledger Components

France . 8,366 parts In-Stock

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Montano Global Distributors

Canada . 6,486 parts In-Stock

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LMD Electronica

Estonia . 5,909 parts In-Stock

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5,909

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LOOK Integrated Logistics

Peru . 4,771 parts In-Stock

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4,771

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Argo Parts USA

USA . 854 parts In-Stock

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854

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Overview

Power up your applications with the MSC080SMA330B4 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology ensures top-quality products that are reliable and efficient. This N-CHANNEL Power Field Effect Transistor (FET) with a built-in diode is perfect for switching applications, offering a high DS Breakdown Voltage of 3300V and a Maximum Pulsed Drain Current of 100A. With a maximum Power Dissipation of 381W and an operating temperature range from -55 to 150°C, this FET is designed to deliver superior performance and durability. Trust in Microchip Technology to provide you with the best components for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the transistor, ensuring long-term reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better performance and efficiency compared to P-channel transistors, making this a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can protect the transistor from voltage spikes, enhancing its overall performance and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor is optimized for fast switching speeds and high efficiency in various electronic circuits.

Minimum DS Breakdown Voltage: 3300 V

The high breakdown voltage allows the transistor to handle high voltage levels, making it suitable for demanding applications where voltage spikes may occur.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration into circuit designs and mounting on PCBs.

Terminal Form: THROUGH-HOLE

The through-hole terminals offer secure connections and easy soldering during PCB assembly, ensuring reliable electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer precise control over the switching operation, enabling efficient power management and optimal performance in various applications.

Maximum Pulsed Drain Current (IDM): 100 A

The high pulsed drain current rating allows the transistor to handle brief overload conditions without risk of damage, ensuring robust performance in dynamic applications.

No. of Terminals: 4

With four terminals, this transistor provides versatile connections for power, control, and other functions, enhancing its flexibility in circuit designs.

Maximum Power Dissipation (Abs): 381 W

The high power dissipation rating enables the transistor to handle significant heat generation during operation, ensuring reliability under heavy load conditions.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy mounting on heat sinks or other cooling devices, enhancing thermal performance and reliability in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making this transistor a suitable choice for energy-efficient electronic designs.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperature environments, ensuring reliable performance in harsh operating conditions.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance and reliability, making this transistor a durable and efficient choice for various electronic applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the transistor to operate in cold environments without sacrificing performance, making it suitable for a wide range of temperature conditions.

Maximum Drain Current (ID): 41 A

The high drain current rating enables the transistor to handle significant current flows, ensuring reliable operation in high-power circuits and applications.

Maximum Drain-Source On Resistance: 0.105 ohm

The low drain-source on resistance minimizes power loss and heat generation during operation, enhancing efficiency and performance in various electronic circuits.

Terminal Position: SINGLE

The single terminal position simplifies circuit connections and ensures easy integration into circuit designs, improving overall ease of use and reliability.

Case Connection: DRAIN

The drain case connection enhances thermal management and heat dissipation, improving overall reliability and performance in high-power applications.

Maximum Feedback Capacitance (Crss): 4 pF

The low feedback capacitance minimizes signal distortion and improves high-frequency performance, making this transistor suitable for high-speed switching applications.

Technical Specifications

Power Field Effect Transistors (FET) MSC080SMA330B4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

3300 V

Maximum Drain Current (ID):

41 A

Maximum Drain-Source On Resistance:

.105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

4 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MSC080SMA330B4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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