Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Other Function uPs,uCs & Peripheral ICs M1A3P1000L-1FG256I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology
Peripheral IC Type:
M1A3P1000L-1FG256I Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - Datasheet 30/Jan/2023
PCN Assembly/Origin - Assembly Site 15/Feb/2022
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
2N2222A
Semitronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
1N4148WS
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
BAV99
STMicroelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
Changzhou Galaxy Century Microelectronics
ULN2803ADWRG4
Texas Instruments
ULN2803ADWRG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output, and built-in transient protection. It operates b/w -40 to 85 °C with a max supply voltage of 3 V. Ideal for applications requiring sink current flow direction in a small outline package style.
BAV99WT1G
MBRS130LT3G
Onsemi
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Electronic Devices
NC7WZ17P6X
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
MBRS340T3G
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
SMBJ18CA
Protek Devices
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MSP430F6777AIPZR
MSP430F6777AIPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.
DA14531-00000FX2
Renesas Electronics
SoC; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 1;
AM4376BZDN80
AM4376BZDN80 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w 0-90°C, with supply voltage range of 1.21-1.326V. Ideal for applications requiring high performance and compact design.
RN2903A-I/RM105
Microchip Technology
Microchip Technology's RN2903A-I/RM105 is a surface mount microprocessor circuit with 47 terminals. It operates at a supply voltage range of 2.1V to 3.6V and can withstand temperatures from -40°C to 85°C. This industrial-grade peripheral IC is commonly used in various applications requiring low-power consumption and compact size.
XCZU4EV-1SFVC784I
Xilinx
XCZU4EV-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.
SLB9665XQ20FW563XUMA2
Infineon's SLB9665XQ20FW563XUMA2 is a 32-terminal cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for applications requiring secure authentication in compact spaces due to its very thin profile and square shape package design.
CY8CPLC10-28PVXIT
CY8CPLC10-28PVXIT by Infineon is a 28-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 4.75V to 5.25V. Ideal for industrial applications requiring small outline packaging and surface mount compatibility at peak reflow temperatures up to 260°C.
XCZU4CG-1SFVC784E
XCZU4CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.
EFR32FG23A010F256GM48-C
Silicon Labs
EFR32FG23A010F256GM48-C by Silicon Labs is a SoC with 48 terminals, operating from -40 to 85°C. It has a supply voltage range of 1.71V to 3.8V and terminal pitch of 0.4mm. Ideal for IoT applications requiring low power consumption and compact design.
BM83SM1-00AA
BM83SM1-00AA by Microchip Technology is a 50-terminal IC with max supply voltage of 4.2V and min operating temp of -40°C. Ideal for applications requiring programmable RFSoC technology in compact microelectronic assemblies.
MCIMX6S5DVM10AC
Freescale Semiconductor
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
P82B715P
The Texas Instruments P82B715P is an 8-terminal IC with a supply voltage range of 4.5V to 12V, operating b/w -40°C to 85°C. It features a max clock frequency of 0.4MHz and supports I2C bus compatibility, making it ideal for industrial microprocessor circuit applications.
Z84C4006PEG
Zilog
Other uPs/uCs/Peripheral ICs; Terminal Finish: Matte Tin (Sn); JESD-609 Code: e3;
MIMXRT1051CVJ5BR
NXP Semiconductors
The NXP Semiconductors MIMXRT1051CVJ5BR is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring a low profile, fine pitch package style and grid array configuration.
D2-92683-QR-T
Intersil
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 72; Package Code: HVQCCN; Package Shape: SQUARE;
MIMXRT1064CVL5B
NXP Semiconductors' MIMXRT1064CVL5B is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating from -40 to 105 °C, it supports a supply voltage range of 1.15-1.26 V for industrial applications requiring high performance and reliability.
ESP32-WROOM-32E-N8R2
Espressif Systems (Shanghai)
ESP32-WROOM-32E-N8R2 by Espressif Systems is a 38-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for IoT applications due to its compact size and surface mount capability.
XC7Z030-L2FBG676I
The Xilinx XC7Z030-L2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
P82B715DR
The Texas Instruments P82B715DR is an industrial-grade microprocessor circuit with I2C bus compatibility. It operates b/w -40 to 85 °C, with a clock frequency of 0.4 MHz. This small outline package has 8 terminals and a supply voltage range of 4.5V to 12V, making it ideal for various peripheral IC applications.
TMS320DM368ZCEDF
TMS320DM368ZCEDF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates in industrial temperature range (-40 to 85 °C) and supports I2C, SPI, UART, USB buses. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile and fine pitch package style.
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M1A3P600L-1FGG484I
SoC; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30;
M1A3P600L-1FGG144I
SoC; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;
M1A3P600L-1FGG484
SoC; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 250;
M1A3PE3000L-1PQG208
SoC; Peak Reflow Temperature (C): 245; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;
M1A3PE3000L-1PQG208I
SoC; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 245; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 3;
M1A3P1000L-1FGG256
SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER;
M1A3P600L-1FG144I
M1A3P600L-FG484I
M1A3PE3000L-PQG208
SoC; Terminal Finish: MATTE TIN; Peak Reflow Temperature (C): 245; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
M1A3P1000L-1FG144I
M1A3P1000L-1FG144
M1A3P1000L-1FG256
M1A3P1000L-1FGG144I
SoC; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3;
M1A3P1000L-1FGG144
SoC; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
M1A3P1000L-FG144I
M1A3P1000L-FG144
M1A3P1000L-FGG144I
SoC; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
M1A3P1000L-FGG144
SoC; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30;
M1A3P1000L-FGG256I
SoC; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;
M1A3P1000L-FGG256
SoC; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250; Maximum Time At Peak Reflow Temperature (s): 30;
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