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DSPIC33FJ64GP802T-I/MM

Microchip Technology

DSPIC33FJ64GP802T-I/MM by Microchip Technology

DSPIC33FJ64GP802T-I/MM by Microchip is a 16-bit DSP with max clock freq of 40 MHz. Operating temp range -40 to 85 °C, supply voltage 3-3.6 V. Ideal for industrial applications requiring high-speed signal processing in compact form factor.

Median Price

$7.650

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$7.650

100+ parts

-

1k+ parts

-

10k+ parts

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600

$7.650

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-

-

Vyrian

USA . 6,196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,196

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HZD GmbH

Germany . 1,050 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,050

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,114 parts In-Stock

1+ parts

$5.590

100+ parts

-

1k+ parts

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10k+ parts

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1,114

$5.590

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Continental Prestige Electronics

USA . 5,340 parts In-Stock

1+ parts

$7.650

100+ parts

-

1k+ parts

-

10k+ parts

$7.497

5,340

$7.650

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-

$7.497

AZTECH Wire

Italy . 635 parts In-Stock

1+ parts

$9.670

100+ parts

-

1k+ parts

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10k+ parts

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635

$9.670

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-

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Lixinc

USA . 5,255 parts In-Stock

1+ parts

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100+ parts

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5,255

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Fulton Briggs Corp.

USA . 4,833 parts In-Stock

1+ parts

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100+ parts

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4,833

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Argo Parts USA

USA . 3,407 parts In-Stock

1+ parts

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3,407

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$7.497

1k+ parts

$7.268

10k+ parts

$7.115

1,000

-

$7.497

$7.268

$7.115

Overview

Unlock the power of cutting-edge technology with Microchip Technology's DSPIC33FJ64GP802T-I/MM digital signal processor. Designed for optimal performance and reliability, this chip is perfect for a wide range of applications in industries such as automotive, industrial control, and consumer electronics. With its advanced features and high-quality manufacturing, this DSP offers customers unmatched value and benefits. Experience faster processing speeds, improved efficiency, and seamless integration with the DSPIC33FJ64GP802T-I/MM, setting your projects apart from the competition. Elevate your designs to new heights with this top-of-the-line digital signal processor from Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various environments.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while ensuring safe operation within specified limits.

Bit Size: 16

Provides sufficient processing power for handling complex digital signal processing tasks efficiently.

No. of Terminals: 28

Offers a sufficient number of connections for interfacing with external devices and components.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in harsh environments with low temperatures.

Maximum Clock Frequency: 40 MHz

Enables fast data processing and high-speed operation for real-time signal processing applications.

ROM Programmability: FLASH

Allows for reprogramming and updating the firmware easily, enhancing flexibility and adaptability of the product.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ64GP802T-I/MM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Trade Compliance

DSPIC33FJ64GP802T-I/MM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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