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DSPIC33FJ32MC304-I/ML

Microchip Technology

DSPIC33FJ32MC304-I/ML by Microchip Technology

DSPIC33FJ32MC304-I/ML by Microchip Technology is a 16-bit digital signal processor with 3.3V power supply, 44 terminals, and 8 DMA channels. It operates in industrial temperatures (-40 to 85°C) and features flash ROM programmability for applications requiring high-performance controllers or signal processing capabilities. The chip's compact square package with a low profile makes it suitable for space-constrained designs.

Median Price

$5.960

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,485 parts In-Stock

1+ parts

$5.960

100+ parts

$4.940

1k+ parts

$4.560

10k+ parts

$4.350

1,485

$5.960

$4.940

$4.560

$4.350

DigiKey

USA . 45 parts In-Stock

1+ parts

$5.960

100+ parts

$4.940

1k+ parts

-

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-

45

$5.960

$4.940

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Future Electronics

Canada . 25 parts In-Stock

1+ parts

-

100+ parts

$4.690

1k+ parts

$4.590

10k+ parts

-

25

-

$4.690

$4.590

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$5.320

100+ parts

-

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900

$5.320

-

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NAC Semi

USA . 1,170 parts In-Stock

1+ parts

$6.210

100+ parts

$5.630

1k+ parts

$5.150

10k+ parts

-

1,170

$6.210

$5.630

$5.150

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Vyrian

USA . 3,824 parts In-Stock

1+ parts

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3,824

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IBS Electronics

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$6.578

1k+ parts

$6.437

10k+ parts

-

25

-

$6.578

$6.437

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 498 parts In-Stock

1+ parts

$4.240

100+ parts

-

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498

$4.240

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-

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Continental Prestige Electronics

USA . 2,234 parts In-Stock

1+ parts

$5.320

100+ parts

-

1k+ parts

-

10k+ parts

$5.214

2,234

$5.320

-

-

$5.214

AZTECH Wire

Italy . 757 parts In-Stock

1+ parts

$16.062

100+ parts

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757

$16.062

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West Coast Incorporated

USA . 6,527 parts In-Stock

1+ parts

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6,527

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Argo Parts USA

USA . 4,290 parts In-Stock

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4,290

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Lixinc

USA . 2,838 parts In-Stock

1+ parts

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2,838

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iodParts Technologies Inc.

India . 2,355 parts In-Stock

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2,355

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Perfect Parts

USA . 57 parts In-Stock

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57

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Overview

Unleash the power of innovation with the Microchip Technology DSPIC33FJ32MC304-I/ML digital signal processor. A leading manufacturer in the industry, Microchip Technology delivers top-notch quality and reliability. This versatile DSP is perfect for a wide range of applications, offering customers unparalleled value and benefits. Experience enhanced performance and efficiency with this cutting-edge product, designed to meet the demands of modern technology. Elevate your projects to new heights with the DSPIC33FJ32MC304-I/ML by Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and resources.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V allows for flexibility in power input options.

On Chip Data RAM Width: 16

Having a data RAM width of 16 enables efficient data processing and storage capabilities.

Package Shape: SQUARE

The square package shape is space-efficient and helps in optimizing PCB layout.

Bit Size: 16

With a bit size of 16, this DSP can handle complex mathematical operations with precision.

Power Supplies (V): 3.3

The standard power supply of 3.3V ensures compatibility with common power sources.

No. of Terminals: 44

Having 44 terminals provides ample connectivity options for interfacing with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options offer versatility in mounting and thermal management for various applications.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures stable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance in harsh environments.

No. of External Interrupts: 3

Having 3 external interrupts enables the DSP to respond to external events promptly.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures functionality in cold climates or industrial settings.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides good solderability and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connection to the PCB.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm enables compact and slim device designs.

Width: 8 mm

The compact width of 8mm saves PCB space and facilitates dense circuit designs.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging the DSP during production and maintenance.

Maximum Time At Peak Reflow Temperature (s): 40

The specified reflow time of 40 seconds ensures proper solder reflow and component bonding during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering of the DSP on the PCB.

Length: 8 mm

The short length of 8mm contributes to the overall compactness of the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the DSP's performance and reliability in demanding industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The combination of DSP and controller functionality makes this product versatile for a wide range of signal processing applications.

No. of Timers: 5

The inclusion of 5 timers provides precise timing control for various operations in the application.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient signal processing.

Terminal Form: NO LEAD

No-lead terminal form ensures environmental friendliness and compliance with lead-free regulations.

Maximum Supply Current: 76 mA

The maximum supply current of 76mA indicates the power efficiency of the DSP during operation.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent power supply for optimal performance.

No. of DMA Channels: 8

Having 8 DMA channels allows for efficient data transfer between peripherals and memory without CPU intervention.

No. of Serial I/Os: 2

The 2 serial I/Os enable communication with external devices using serial protocols.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating and reprogramming the DSP's firmware as needed.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting on the PCB for space-saving designs.

Format: FLOATING POINT

Support for floating-point format enhances the DSP's ability to handle complex mathematical calculations with greater precision.

Low Power Mode: YES

The low power mode feature helps in conserving energy and extending the battery life of the device.

On Chip Program ROM Width: 24

Having a program ROM width of 24 provides ample storage for program instructions, enhancing the DSP's versatility.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ32MC304-I/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

8

No. of External Interrupts:

3

No. of Serial I/Os:

2

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

76 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

DSPIC33FJ32MC304-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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