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DSPIC33FJ32MC202-E/MM

Microchip Technology

DSPIC33FJ32MC202-E/MM by Microchip Technology

DSPIC33FJ32MC202-E/MM by Microchip Technology is a 16-bit digital signal processor with 2048 RAM words and 24 ROM programmability. It operates at a max clock frequency of 40 MHz, suitable for automotive applications requiring high-speed processing and low power consumption. With 3 external interrupts and 5 timers, it offers versatile control capabilities in a compact chip carrier package.

Median Price

$5.530

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 91 parts In-Stock

1+ parts

$5.530

100+ parts

$4.590

1k+ parts

$4.230

10k+ parts

$4.020

91

$5.530

$4.590

$4.230

$4.020

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,092 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,092

-

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

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Semi Source

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,946 parts In-Stock

1+ parts

$1.603

100+ parts

-

1k+ parts

$1.539

10k+ parts

$1.539

2,946

$1.603

-

$1.539

$1.539

AZTECH Wire

Italy . 395 parts In-Stock

1+ parts

$19.360

100+ parts

-

1k+ parts

-

10k+ parts

-

395

$19.360

-

-

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Corohmni

South Africa . 1,147 parts In-Stock

1+ parts

$74.046

100+ parts

-

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1,147

$74.046

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-

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Perfect Parts

USA . 6,270 parts In-Stock

1+ parts

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100+ parts

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6,270

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,000

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-

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Continental Prestige Electronics

USA . 2,320 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,320

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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2,000

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RGB Technical Solutions

Ukraine . 1,448 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,448

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Argo Parts USA

USA . 910 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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910

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Overview

Unleash the power of advanced digital signal processing with the Microchip Technology DSPIC33FJ32MC202-E/MM. Designed for cutting-edge applications, this high-quality DSP offers unparalleled performance and reliability. With a wide range of features and capabilities, this product is perfect for automotive, industrial, and consumer electronics. Experience seamless integration, efficient operation, and innovative solutions with this top-of-the-line digital signal processor. Take your projects to the next level with the DSPIC33FJ32MC202-E/MM from Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material makes the package lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage ensures compatibility with a wide range of power sources.

On Chip Data RAM Width: 8

Wider data RAM width allows for faster data processing and storage capabilities.

Screening Level: TS 16949

Compliance with TS 16949 standards ensures high quality and reliability in automotive applications.

Package Shape: SQUARE

Square package shape helps in efficient utilization of PCB real estate.

Bit Size: 16

16-bit architecture provides higher processing capabilities and precision.

Power Supplies (V): 3.3

Stable power supply voltage of 3.3V ensures consistent performance.

No. of Terminals: 28

Higher number of terminals allow for more connectivity options and flexibility in system design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer versatility in mounting and thermal management.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures compatibility with a variety of power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range makes it suitable for demanding environments.

No. of External Interrupts: 3

Multiple external interrupts allow for efficient multitasking and real-time processing.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range makes it suitable for use in cold climates.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and reliable electrical connections.

ADC Channels: YES

Built-in ADC channels enable analog signal processing capabilities.

Terminal Position: QUAD

Quad terminal position offers better mechanical strength and stability during PCB assembly.

Maximum Seated Height: 1 mm

Low seated height makes it suitable for compact and slim designs.

RAM Words: 2048

Large RAM capacity allows for efficient data storage and processing.

Width: 6 mm

Compact width enables space-saving PCB layout designs.

Boundary Scan: YES

Boundary scan feature allows for easy debugging and testing of the DSP.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast processing and data throughput.

Maximum Time At Peak Reflow Temperature (s): 40

Sustainable maximum time at peak reflow temperature ensures reliability during soldering process.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for robust solder joints and durability.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer speeds and system performance.

Length: 6 mm

Compact length enables space-efficient PCB designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable operation in automotive applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionality offers versatile processing capabilities.

No. of Timers: 5

Multiple timer channels allow for efficient time management and scheduling of tasks.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and RoHS directives.

Maximum Supply Current: 80 mA

Low supply current consumption ensures energy efficiency and longer battery life.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and reliability.

PWM Channels: YES

Built-in PWM channels enable precise control of analog signals and voltage levels.

ROM Programmability: FLASH

Flash programmable ROM allows for easy updating and customization of firmware.

Terminal Pitch: 0.65 mm

Narrow terminal pitch enables high-density mounting and space-saving PCB designs.

Format: FIXED POINT

Fixed-point format offers efficient and fast arithmetic operations.

Speed: 40 rpm

High processing speed of 40 rpm ensures real-time data processing and response.

Low Power Mode: YES

Low power mode feature helps in energy conservation and prolonging battery life.

Barrel Shifter: YES

Barrel shifter functionality enables efficient data manipulation and processing.

On Chip Program ROM Width: 24

Wide program ROM width allows for storing larger firmware and program code.

No. of I/O Lines: 21

Adequate number of I/O lines provide flexibility in connecting to external devices and peripherals.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ32MC202-E/MM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

3

No. of I/O Lines:

21

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

2048

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Trade Compliance

DSPIC33FJ32MC202-E/MM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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