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DSPIC33FJ256MC510A-I/PF

Microchip Technology

DSPIC33FJ256MC510A-I/PF by Microchip Technology

DSPIC33FJ256MC510A-I/PF by Microchip Technology is a 16-bit DSP with 3.3V supply, 40MHz clock speed, and 16384 RAM words. Ideal for industrial applications requiring high-speed processing, it features 11 timers, ADC channels, and PWM channels for precise control in digital signal processing tasks.

Median Price

$9.920

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,340 parts In-Stock

1+ parts

$9.920

100+ parts

$8.220

1k+ parts

$7.570

10k+ parts

$7.210

2,340

$9.920

$8.220

$7.570

$7.210

DigiKey

USA . 90 parts In-Stock

1+ parts

$9.920

100+ parts

$8.220

1k+ parts

-

10k+ parts

-

90

$9.920

$8.220

-

-

Mouser Electronics

USA . 85 parts In-Stock

1+ parts

$9.920

100+ parts

$8.220

1k+ parts

-

10k+ parts

-

85

$9.920

$8.220

-

-

Verical

USA . 270 parts In-Stock

1+ parts

-

100+ parts

$9.081

1k+ parts

-

10k+ parts

-

270

-

$9.081

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 78 parts In-Stock

1+ parts

$8.820

100+ parts

-

1k+ parts

-

10k+ parts

-

78

$8.820

-

-

-

NAC Semi

USA . 1,890 parts In-Stock

1+ parts

$10.290

100+ parts

$9.330

1k+ parts

$8.540

10k+ parts

-

1,890

$10.290

$9.330

$8.540

-

Vyrian

USA . 7,646 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,646

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,177 parts In-Stock

1+ parts

$7.020

100+ parts

-

1k+ parts

-

10k+ parts

-

1,177

$7.020

-

-

-

Andel Nordic

Denmark . 1,863 parts In-Stock

1+ parts

$7.723

100+ parts

-

1k+ parts

$7.414

10k+ parts

$7.414

1,863

$7.723

-

$7.414

$7.414

Continental Prestige Electronics

USA . 2,469 parts In-Stock

1+ parts

$8.820

100+ parts

-

1k+ parts

-

10k+ parts

$8.644

2,469

$8.820

-

-

$8.644

Microchip USA

USA . 2,700 parts In-Stock

1+ parts

$29.176

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

$29.176

-

-

-

Corohmni

South Africa . 567 parts In-Stock

1+ parts

$32.302

100+ parts

-

1k+ parts

-

10k+ parts

-

567

$32.302

-

-

-

RGB Technical Solutions

Ukraine . 8,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,340

-

-

-

-

Lixinc

USA . 2,436 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,436

-

-

-

-

Argo Parts USA

USA . 1,409 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,409

-

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$8.644

1k+ parts

$8.379

10k+ parts

$8.203

1,000

-

$8.644

$8.379

$8.203

Overview

Experience the power of innovation with the DSPIC33FJ256MC510A-I/PF by Microchip Technology. As a leader in the industry, Microchip Technology brings you cutting-edge Digital Signal Processors that guarantee top-quality performance and reliability. Ideal for a wide range of applications, this DSP offers unmatched value to customers seeking seamless integration, high-speed processing, and low power consumption. Elevate your projects with the DSPIC33FJ256MC510A-I/PF and discover the endless possibilities it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the DSP, making it durable and reliable.

Surface Mount: YES

Allows for easy and convenient integration into circuit boards, saving space and improving overall layout efficiency.

Maximum Supply Voltage: 3.6 V

Operates efficiently within a safe voltage range, ensuring stability and longevity of the DSP.

On Chip Data RAM Width: 8

Provides sufficient memory capacity for storing and manipulating data, enhancing performance and processing capabilities.

Screening Level: TS 16949

Complies with quality standards for automotive industry, ensuring high reliability and performance in harsh environments.

Package Shape: SQUARE

Facilitates easy placement and routing of connections on the circuit board, enabling a more compact and efficient design.

Bit Size: 16

Offers precision and accuracy in data processing, making it suitable for applications requiring high computational performance.

Power Supplies (V): 3.3

Operates at a standard voltage level, making it compatible with most power sources and reducing the need for additional voltage regulation.

No. of Terminals: 100

Provides a sufficient number of connections for interfacing with external components, expanding the functionality and versatility of the DSP.

Package Style (Meter): FLATPACK, THIN PROFILE

Offers a compact form factor for space-constrained applications, allowing for easy integration into various electronic devices.

Minimum Supply Voltage: 3 V

Maintains operational stability even at lower voltage levels, ensuring reliable performance in diverse operating conditions.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, making it suitable for industrial applications where heat dissipation is a concern.

No. of External Interrupts: 5

Enables efficient handling of external events or signals, enhancing real-time responsiveness and interrupt-driven processing capabilities.

Minimum Operating Temperature: -40 °C

Operates reliably in cold environments, making it suitable for outdoor or automotive applications subjected to extreme temperatures.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish for the terminals, ensuring long-term connectivity and signal integrity.

ADC Channels: YES

Supports analog-to-digital conversion for interfacing with external sensors or signals, expanding the range of applications for the DSP.

DMA Channels: YES

Enhances data transfer efficiency and offloads processing tasks, improving overall system performance and responsiveness.

Terminal Position: QUAD

Facilitates easy connection to external devices or peripherals, simplifying the integration process and reducing wiring complexity.

Maximum Seated Height: 1.2 mm

Slim profile enables compact and low-profile designs, ideal for space-constrained applications or portable devices.

RAM Words: 16384

Provides ample memory storage for data and program instructions, enabling complex algorithms and processing tasks to be executed efficiently.

Width: 14 mm

Compact size allows for versatile installation options, accommodating various form factors and space restrictions in electronic systems.

Boundary Scan: YES

Facilitates testing and debugging of the DSP during manufacturing or maintenance, improving reliability and ease of troubleshooting.

Maximum Clock Frequency: 40 MHz

Supports high-speed processing and data transfer rates, making it suitable for real-time applications that require rapid computational capabilities.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering and thermal stability during assembly, preventing damage to the DSP and ensuring long-term performance.

Peak Reflow Temperature °C: 260

Withstands high temperatures during the reflow soldering process, ensuring proper solder joint formation and optimal connectivity.

Internal Bus Architecture: MULTIPLE

Enhances data transfer efficiency and parallel processing capabilities, improving overall system performance and throughput.

Length: 14 mm

Compact form factor allows for versatile placement and integration options, accommodating space constraints in diverse electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in rugged conditions and extended temperature ranges.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Versatile peripheral interface allows for seamless integration with various external components and sensors, expanding the functionality of the DSP.

No. of Timers: 11

Supports precise timing and scheduling functions, enabling efficient control and coordination of operations in time-critical applications.

Technology: CMOS

Utilizes low power consumption and high integration density, enabling energy-efficient and compact designs with improved performance.

Terminal Form: GULL WING

Facilitates easy soldering and robust mechanical connections, ensuring reliable and durable terminal-to-board interfaces.

Maximum Supply Current: 90 mA

Operates within a low power consumption range, reducing energy costs and heat generation while maintaining optimal performance levels.

Nominal Supply Voltage: 3.3 V

Standard voltage level ensures compatibility with common power sources and simplifies system design and integration.

No. of DMA Channels: 8

Enables efficient data transfer and processing, optimizing system performance and reducing CPU overhead for improved responsiveness.

No. of Serial I/Os: 4

Supports serial communication interfaces for connecting to external devices, expanding connectivity options and data transfer capabilities.

PWM Channels: YES

Provides pulse-width modulation capabilities for precise control of digital signals, enabling flexible and efficient motor or power management.

ROM Programmability: FLASH

Allows for reprogrammable and flexible firmware updates, enhancing adaptability and extending the lifespan of the DSP in evolving applications.

Terminal Pitch: 0.5 mm

Fine pitch spacing enables high-density mounting and compact designs, ideal for miniaturized electronic devices and space-constrained applications.

Format: FIXED POINT

Optimized for fixed-point arithmetic operations, offering efficient computation and precision for a wide range of signal processing applications.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure during handling and assembly processes, ensuring long-term reliability and performance.

Speed: 40 rpm

Supports fast data processing and execution speeds, enabling real-time responsiveness and efficient signal processing capabilities.

Low Power Mode: YES

Enhances energy efficiency and extends battery life in portable or battery-powered devices, reducing overall power consumption while maintaining functionality.

Barrel Shifter: YES

Facilitates efficient data manipulation and processing operations, improving computational efficiency and enabling complex algorithm execution.

On Chip Program ROM Width: 24

Provides ample storage capacity for program instructions, enabling the implementation of sophisticated algorithms and processing tasks.

No. of I/O Lines: 85

Offers a high number of input/output connections for interfacing with external peripherals, expanding the versatility and connectivity options of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ256MC510A-I/PF attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

5

No. of I/O Lines:

85

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Trade Compliance

DSPIC33FJ256MC510A-I/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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