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DSPIC33FJ256GP506AT-I/MR

Microchip Technology

DSPIC33FJ256GP506AT-I/MR by Microchip Technology

DSPIC33FJ256GP506AT-I/MR by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating at -40 to 85°C. It has 64 terminals, flash ROM programmability, and operates on 3.3V supply. Ideal for industrial applications requiring digital signal processing and control functions in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,202 parts In-Stock

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7,202

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 995 parts In-Stock

1+ parts

$7.000

100+ parts

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995

$7.000

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Corohmni

South Africa . 174 parts In-Stock

1+ parts

$9.170

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174

$9.170

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Semicontronic

India . 192 parts In-Stock

1+ parts

$16.000

100+ parts

$15.600

1k+ parts

$15.520

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192

$16.000

$15.600

$15.520

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AZTECH Wire

Italy . 588 parts In-Stock

1+ parts

$16.169

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588

$16.169

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Aztec Data Supply Inc.

USA . 100 parts In-Stock

1+ parts

$74.161

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100

$74.161

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QUARKTWIN TECHNOLOGY LTD

USA . 29,385 parts In-Stock

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29,385

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Marpe Global Electronics

Taiwan . 6,586 parts In-Stock

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6,586

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QualityLine Systems

Poland . 6,586 parts In-Stock

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6,586

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XL Components Corporation

Australia . 6,586 parts In-Stock

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6,586

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Microchip USA

USA . 4,531 parts In-Stock

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4,531

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Argo Parts USA

USA . 2,304 parts In-Stock

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2,304

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Continental Prestige Electronics

USA . 22 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the DSPIC33FJ256GP506AT-I/MR by Microchip Technology! This top-of-the-line digital signal processor offers unparalleled quality and reliability, setting a new standard in the industry. With applications ranging from industrial automation to consumer electronics, this device provides unmatched performance and efficiency. Experience seamless operation and optimized functionality, all while enjoying the peace of mind that comes with choosing a trusted manufacturer like Microchip Technology. Upgrade your projects today with the DSPIC33FJ256GP506AT-I/MR and discover a world of endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into various PCB designs, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in powering the device within a safe operating range, ensuring stable performance.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making it ideal for compact electronic designs.

Bit Size: 16

The 16-bit size offers improved processing capabilities, allowing for faster and more efficient digital signal processing tasks.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with standard electrical systems, making the product versatile for a wide range of applications.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with other components, enabling complex signal processing algorithms.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package styles offer efficient heat dissipation and compact form factor, essential for high-performance applications in limited space.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures energy efficiency and extends battery life in power-constrained devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, suitable for industrial use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in freezing conditions, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and conductivity, ensuring secure and reliable connections on the PCB.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and routing, optimizing signal integrity and reducing electromagnetic interference.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim profile design, suitable for space-constrained applications.

Width: 9 mm

The 9mm width offers a compact form factor, making the product easy to integrate into small electronic devices.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency enables fast signal processing and response times, crucial for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

The generous reflow time window of 40 seconds allows for accurate and reliable soldering processes during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures robust solder joints, essential for withstanding thermal stress and maintaining electrical connections.

Length: 9 mm

The 9mm length offers a compact footprint, suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding environments, making the product suitable for industrial automation and control systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The product's digital signal processing and controller capabilities provide versatile functionality for a wide range of signal processing and control applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and reduces environmental impact, complying with industry standards.

Maximum Supply Current: 90 mA

The low maximum supply current ensures efficient power consumption, making the product suitable for battery-powered devices.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures stable and consistent power delivery, essential for reliable performance.

ROM Programmability: FLASH

The flash ROM programmability allows for flexible firmware updates and customization, enabling adaptability to changing requirements.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch offers high-density connectivity, ideal for applications requiring a large number of connections in a small space.

Format: FIXED POINT

The fixed-point format simplifies mathematical operations and reduces computational complexity, enhancing processing efficiency.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ256GP506AT-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33FJ256GP506AT-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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