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DSPIC33FJ128MC204-I/ML

Microchip Technology

DSPIC33FJ128MC204-I/ML by Microchip Technology

DSPIC33FJ128MC204-I/ML by Microchip Technology is a 16-bit DSP with 3.3V supply, 44 terminals, and operates in industrial temperatures. It features 8 DMA channels, FLASH ROM programmability, and low power mode. Ideal for digital signal processing applications requiring high performance in compact designs.

Median Price

$7.010

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 368 parts In-Stock

1+ parts

$7.010

100+ parts

$5.830

1k+ parts

$5.370

10k+ parts

$5.110

368

$7.010

$5.830

$5.370

$5.110

DigiKey

USA . 135 parts In-Stock

1+ parts

$7.010

100+ parts

$5.830

1k+ parts

-

10k+ parts

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135

$7.010

$5.830

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 270 parts In-Stock

1+ parts

$7.260

100+ parts

$6.590

1k+ parts

$6.020

10k+ parts

-

270

$7.260

$6.590

$6.020

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Vyrian

USA . 5,817 parts In-Stock

1+ parts

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5,817

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ComSIT Distribution GmbH

Germany . 225 parts In-Stock

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225

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Nova Conductors

Japan . 60 parts In-Stock

1+ parts

-

100+ parts

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 117 parts In-Stock

1+ parts

$5.660

100+ parts

-

1k+ parts

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117

$5.660

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A-Z Elektronik GmbH

Germany . 5,420 parts In-Stock

1+ parts

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100+ parts

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5,420

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Alle Elektronik GmbH

Germany . 3,613 parts In-Stock

1+ parts

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3,613

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Fulton Briggs Corp.

USA . 1,576 parts In-Stock

1+ parts

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1,576

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Netroflash

USA . 100 parts In-Stock

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100

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Perfect Parts

USA . 68 parts In-Stock

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68

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Overview

Experience the power of innovation with the Microchip Technology DSPIC33FJ128MC204-I/ML Digital Signal Processor. Renowned for its quality and reliability, Microchip Technology delivers cutting-edge solutions in the field of digital signal processors. Ideal for a wide range of applications, this product offers unparalleled value and benefits to customers seeking high-performance processing capabilities. Unlock your potential with the DSPIC33FJ128MC204-I/ML and see the difference that Microchip Technology can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications without adding much to the overall cost.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in power supply options.

On Chip Data RAM Width: 16

Provides ample memory for data processing without the need for external storage, enhancing performance.

Package Shape: SQUARE

Squares shapes are easier to handle and integrate in designs, optimizing space on the PCB.

Bit Size: 16

This bit size allows for handling a wide range of mathematical calculations and processing tasks efficiently.

Power Supplies (V): 3.3

Standard power supply voltage ensures compatibility with existing systems and components.

No. of Terminals: 44

Sufficient number of terminals for connecting to various peripherals and interfaces, expanding the product's capabilities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Different package styles offer flexibility in mounting and cooling options, adapting to specific application requirements.

Minimum Supply Voltage: 3 V

Can operate even at lower voltages, providing energy efficiency and potential for battery-powered applications.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, enabling operation in harsh environments without degradation in performance.

No. of External Interrupts: 3

Allows for handling external events efficiently, enhancing real-time response capabilities.

Minimum Operating Temperature: -40 °C

Capable of operating in very low temperatures, suitable for applications in extreme cold environments.

Terminal Finish: MATTE TIN

Matte finish improves soldering quality and overall reliability of connections on the terminals.

Terminal Position: QUAD

Quad position terminals are more stable and secure, reducing the risk of disconnection during operation.

Maximum Seated Height: 1 mm

Low seated height saves space on the PCB and allows for compact designs.

Width: 8 mm

Compact width facilitates placement in dense PCB layouts while maintaining effective heat dissipation.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the product during production and maintenance.

Maximum Time At Peak Reflow Temperature (s): 40

Optimal time at peak reflow temperature ensures proper soldering and component reliability during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance makes the product suitable for lead-free soldering processes.

Length: 8 mm

Compact length contributes to the overall small form factor of the product, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in a wide range of temperature conditions in industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionalities provides versatile processing capabilities for various applications.

No. of Timers: 5

Multiple timers enable precise timing control for different processes, enhancing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, balancing performance and energy efficiency.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safer handling during production and disposal.

Maximum Supply Current: 76 mA

Moderate supply current requirement results in energy-efficient operation and longer battery life in portable devices.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

No. of DMA Channels: 8

Multiple DMA channels allow for efficient data transfer between peripherals and memory, reducing processor load.

No. of Serial I/Os: 2

Serial I/O interfaces enable communication with external devices, expanding connectivity options.

ROM Programmability: FLASH

Flash programmable ROM offers flexibility in updating firmware and software, improving product lifespan and functionality.

Terminal Pitch: 0.65 mm

Narrow terminal pitch enables high-density mounting, saving space on the PCB and facilitating miniaturization.

Format: FLOATING POINT

Floating-point format supports complex mathematical operations with precision, essential for signal processing tasks.

Low Power Mode: YES

Low power mode option enhances energy efficiency, extending battery life and reducing overall power consumption.

On Chip Program ROM Width: 24

Wide program ROM width accommodates large software codes, enabling extensive program storage on the chip.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ128MC204-I/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

8

No. of External Interrupts:

3

No. of Serial I/Os:

2

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

76 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

DSPIC33FJ128MC204-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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