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DSPIC33EV128GM002-I/SO

Microchip Technology

DSPIC33EV128GM002-I/SO by Microchip Technology

DSPIC33EV128GM002-I/SO by Microchip Technology is a 16-bit DSP with 131072 ROM words, 8192 RAM words, and 11-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring a max clock frequency of 40 MHz, featuring low power mode and multiple peripherals like PWM(6) and TIMER(7).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,876 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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AZTECH Wire

Italy . 189 parts In-Stock

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$14.024

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$14.024

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Ampacity Inc.

Singapore . 254 parts In-Stock

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$21.000

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Aztec Data Supply Inc.

USA . 1,588 parts In-Stock

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$43.320

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Corohmni

South Africa . 5,013 parts In-Stock

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$50.485

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Marpe Global Electronics

Taiwan . 6,828 parts In-Stock

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QualityLine Systems

Poland . 6,828 parts In-Stock

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XL Components Corporation

Australia . 6,828 parts In-Stock

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Continental Prestige Electronics

USA . 2,801 parts In-Stock

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Argo Parts USA

USA . 2,157 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the DSPIC33EV128GM002-I/SO by Microchip Technology. As a leader in the industry, Microchip Technology ensures top-notch quality and reliability in their products, making this digital signal processor a game-changer in various applications. From industrial automation to consumer electronics, this versatile DSP offers unmatched performance and advanced features that provide customers with unparalleled value and innovation. Experience the difference with Microchip Technology and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage allows for flexibility in power input options, ensuring compatibility with a wide range of systems.

ADC Channels: YES

The presence of Analog to Digital Convertors allows for effective signal processing and conversion, enhancing the product's functionality.

Maximum Clock Frequency: 40 MHz

High clock frequency enables efficient processing and quick response times, making the product suitable for demanding applications.

Connectivity: I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Multiple connectivity options ensure seamless integration with various devices and systems, enhancing the product's versatility.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV128GM002-I/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

21

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(4), DMA(4), POR, PWM(6), TIMER(7), WDT

Analog To Digital Convertors:

11-Ch 12-Bit

Trade Compliance

DSPIC33EV128GM002-I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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