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DSPIC33EP64MC206-E/MR

Microchip Technology

DSPIC33EP64MC206-E/MR by Microchip Technology

DSPIC33EP64MC206-E/MR by Microchip Technology is a 16-bit digital signal processor with a max clock frequency of 60 MHz. It operates at temperatures ranging from -40 to 125 °C and has 8192 RAM words. Ideal for automotive applications, it features low power mode, flash ROM programmability, and 3.3 V nominal voltage.

Median Price

$4.470

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,215 parts In-Stock

1+ parts

$4.470

100+ parts

$3.720

1k+ parts

$3.420

10k+ parts

$3.240

1,215

$4.470

$3.720

$3.420

$3.240

DigiKey

USA . 200 parts In-Stock

1+ parts

$4.470

100+ parts

$3.720

1k+ parts

-

10k+ parts

-

200

$4.470

$3.720

-

-

Mouser Electronics

USA . 112 parts In-Stock

1+ parts

$4.470

100+ parts

$4.090

1k+ parts

$3.720

10k+ parts

-

112

$4.470

$4.090

$3.720

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.988

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$3.988

-

-

-

NAC Semi

USA . 4,840 parts In-Stock

1+ parts

$4.650

100+ parts

$4.210

1k+ parts

$3.850

10k+ parts

-

4,840

$4.650

$4.210

$3.850

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Vyrian

USA . 94 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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94

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 116 parts In-Stock

1+ parts

$3.650

100+ parts

-

1k+ parts

-

10k+ parts

-

116

$3.650

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.988

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$3.988

-

-

-

AZTECH Wire

Italy . 766 parts In-Stock

1+ parts

$17.940

100+ parts

-

1k+ parts

-

10k+ parts

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766

$17.940

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-

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Fulton Briggs Corp.

USA . 7,308 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,308

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Overview

Revolutionize your digital signal processing with the Microchip Technology DSPIC33EP64MC206-E/MR. Crafted with precision and expertise, this cutting-edge digital signal processor offers unparalleled performance and reliability for a wide range of applications. From automotive to industrial automation, this DSP delivers exceptional value, efficiency, and versatility. Experience seamless operation and unmatched quality with Microchip Technology's innovative DSPs. Elevate your projects to new heights with the DSPIC33EP64MC206-E/MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the DSP, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle a higher voltage input, making it versatile for different applications.

RAM Words: 8192

Ample memory capacity for storing and processing data efficiently.

Maximum Clock Frequency: 60 MHz

High clock frequency enables fast processing speeds for real-time applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Versatile functionality for signal processing and control applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and convenient updates to the firmware.

Low Power Mode: YES

Helps in conserving power and extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP64MC206-E/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP64MC206-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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