Loading...

DSPIC33EP512GP502-E/SO

Microchip Technology

DSPIC33EP512GP502-E/SO by Microchip Technology

DSPIC33EP512GP502-E/SO by Microchip is a 16-bit DSP with max clock freq of 60MHz, operating temp range -40 to 125°C. Ideal for automotive applications due to AEC-Q100 screening level, flash ROM programmability, and small outline package style.

Median Price

$5.370

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$5.370

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$5.370

-

-

-

Vyrian

USA . 4,244 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,244

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 500 parts In-Stock

1+ parts

$5.370

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$5.370

-

-

-

AZTECH Wire

Italy . 850 parts In-Stock

1+ parts

$10.260

100+ parts

-

1k+ parts

-

10k+ parts

-

850

$10.260

-

-

-

Ampacity Inc.

Singapore . 409 parts In-Stock

1+ parts

$23.000

100+ parts

-

1k+ parts

-

10k+ parts

-

409

$23.000

-

-

-

Fulton Briggs Corp.

USA . 2,749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,749

-

-

-

-

Microchip USA

USA . 2,044 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,044

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the Microchip Technology DSPIC33EP512GP502-E/SO Digital Signal Processor. Known for its superior quality and reliability, Microchip Technology brings you a state-of-the-art processor that is perfect for a wide range of applications in the automotive industry and beyond. With a maximum clock frequency of 60 MHz and powerful floating-point format, this DSP offers unmatched performance and efficiency. Experience seamless operation and enhanced functionality with the DSPIC33EP512GP502-E/SO - the ultimate solution for your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, suitable for automotive applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Operates efficiently within a safe voltage range, providing reliable performance.

Screening Level: AEC-Q100

AEC-Q100 compliant, ensuring high reliability and quality standards for automotive electronics.

Bit Size: 16

16-bit architecture enables efficient processing of digital signals with precision.

Power Supplies (V): 3.3

Operates at a standard voltage level of 3.3V, compatible with most power systems.

No. of Terminals: 28

Provides sufficient connectivity options for interfacing with other components in a system.

Package Style (Meter): SMALL OUTLINE

Small outline package design saves space and allows for compact system integration.

Minimum Operating Temperature: -40 °C

Capable of withstanding extreme cold temperatures, suitable for harsh environmental conditions.

Maximum Clock Frequency: 60 MHz

High clock frequency allows for fast and efficient signal processing.

Temperature Grade: AUTOMOTIVE

Designed and tested for automotive temperature requirements, ensuring reliable performance in vehicle applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512GP502-E/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

DSPIC33EP512GP502-E/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20