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DSPIC33EP32MC504-E/MV

Microchip Technology

DSPIC33EP32MC504-E/MV by Microchip Technology

DSPIC33EP32MC504-E/MV by Microchip is a 16-bit DSP with 4096 RAM words, operating at up to 60 MHz. Ideal for automotive applications, it features 3.3 V nominal voltage, -40 to 125 °C temperature range, and AEC-Q100 screening level.

Median Price

$2.926

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 61 parts In-Stock

1+ parts

$2.926

100+ parts

-

1k+ parts

-

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61

$2.926

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Vyrian

USA . 8,507 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,507

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,839 parts In-Stock

1+ parts

$2.926

100+ parts

-

1k+ parts

-

10k+ parts

$2.867

6,839

$2.926

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-

$2.867

Argo Parts USA

USA . 1,363 parts In-Stock

1+ parts

$2.926

100+ parts

-

1k+ parts

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1,363

$2.926

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AZTECH Wire

Italy . 701 parts In-Stock

1+ parts

$10.643

100+ parts

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701

$10.643

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Ampacity Inc.

Singapore . 326 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

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326

$14.000

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Microchip USA

USA . 1,196 parts In-Stock

1+ parts

$19.019

100+ parts

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1,196

$19.019

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West Coast Incorporated

USA . 5,309 parts In-Stock

1+ parts

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5,309

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$2.867

1k+ parts

$2.780

10k+ parts

$2.721

1,000

-

$2.867

$2.780

$2.721

Overview

Unleash the power of cutting-edge technology with the Microchip Technology DSPIC33EP32MC504-E/MV digital signal processor. Crafted by a renowned manufacturer, this DSP offers unparalleled performance and reliability in a compact package. Ideal for automotive applications, this DSP boasts features like low power mode and boundary scan capability, making it a versatile solution for your project needs. Experience seamless operation and unmatched efficiency with the DSPIC33EP32MC504-E/MV, setting new standards in digital signal processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the DSP, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving valuable assembly time.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility in power requirements and tolerance, ensuring reliable operation.

On Chip Data RAM Width: 8

Wide data RAM width enables efficient processing and storage of data, enhancing overall performance.

Screening Level: AEC-Q100; TS 16949

Compliance with automotive standards ensures high quality and reliability, making it suitable for automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy alignment during assembly.

Bit Size: 16

16-bit processing capability offers high precision and accuracy in signal processing tasks.

No. of Terminals: 48

Sufficient number of terminals enable connectivity with peripheral devices and components, increasing versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package styles provide options for different application requirements, ensuring compatibility and optimal thermal management.

Minimum Supply Voltage: 3 V

Lower minimum supply voltage helps in minimizing power consumption and extending battery life in portable devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures reliable performance in extreme conditions, such as automotive or industrial environments.

No. of External Interrupts: 3

Multiple external interrupt options allow for efficient handling of external events or signals, enhancing system responsiveness.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality even in low-temperature environments, ideal for outdoor or industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and resistance to corrosion, ensuring long-term reliability in operation.

Terminal Position: QUAD

Quad terminal position enables secure and stable connection on the PCB, minimizing signal interference and enhancing performance.

Maximum Seated Height: 0.55 mm

Low seated height allows for compact and slim designs, suitable for space-constrained applications.

RAM Words: 4096

Large RAM capacity enables storage of a significant amount of data, supporting complex signal processing algorithms and applications.

Width: 6 mm

Compact width facilitates easy integration and placement on the PCB, optimizing board layout.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the device during manufacturing, ensuring quality and reliability.

Maximum Clock Frequency: 60 MHz

High clock frequency allows for fast processing and execution of instructions, enhancing overall performance.

Length: 6 mm

Compact length contributes to a smaller footprint on the PCB, saving space and allowing for denser designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliability and performance in harsh automotive environments, meeting industry standards.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionality provides versatility for a wide range of signal processing and control applications.

No. of Timers: 5

Multiple timers enable precise timing and synchronization of operations, enhancing the efficiency and accuracy of the system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and reliability.

Terminal Form: NO LEAD

No-lead terminal form simplifies manufacturing and assembly processes, reducing cost and lead time.

Maximum Supply Current: 55 mA

Low supply current helps in reducing power consumption and heat dissipation, contributing to energy efficiency and longer device lifespan.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the DSP, preventing voltage fluctuations and potential damage.

No. of DMA Channels: 4

Multiple DMA channels enable efficient data transfer and processing, improving system performance and reducing CPU overhead.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates of firmware or program code, ensuring flexibility and adaptability in applications.

Terminal Pitch: 0.4 mm

Fine terminal pitch offers high-density packaging and interconnectivity, supporting space-constrained designs and miniaturization.

Format: FIXED POINT

Fixed-point format provides efficient and fast arithmetic operations, suitable for a wide range of DSP applications requiring high performance.

Low Power Mode: YES

Low power mode option helps in reducing power consumption during idle or low-activity periods, improving energy efficiency and extending battery life.

On Chip Program ROM Width: 8

Wide program ROM width enables storage of program code and instructions on-chip, eliminating the need for external memory and reducing component count.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP32MC504-E/MV attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

4096

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

.55 mm

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

DSPIC33EP32MC504-E/MV Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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