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DSPIC33EP32GS506-E/PT

Microchip Technology

DSPIC33EP32GS506-E/PT by Microchip Technology

DSPIC33EP32GS506-E/PT by Microchip is a 16-bit DSP with max clock freq of 60MHz. Ideal for automotive apps, it operates b/w -40 to 125°C, has flash ROM programmability, and supports CMOS technology. With a supply voltage range of 3-3.6V, this thin-profile package has 64 terminals in a square shape.

Median Price

$5.940

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 960 parts In-Stock

1+ parts

$5.940

100+ parts

$4.920

1k+ parts

$4.540

10k+ parts

$4.320

960

$5.940

$4.920

$4.540

$4.320

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 36 parts In-Stock

1+ parts

$5.224

100+ parts

-

1k+ parts

-

10k+ parts

-

36

$5.224

-

-

-

NAC Semi

USA . 800 parts In-Stock

1+ parts

$6.190

100+ parts

$5.610

1k+ parts

$5.130

10k+ parts

-

800

$6.190

$5.610

$5.130

-

Vyrian

USA . 2,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,911

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,813 parts In-Stock

1+ parts

$5.224

100+ parts

-

1k+ parts

-

10k+ parts

$5.120

3,813

$5.224

-

-

$5.120

AZTECH Wire

Italy . 338 parts In-Stock

1+ parts

$8.130

100+ parts

-

1k+ parts

-

10k+ parts

-

338

$8.130

-

-

-

Ampacity Inc.

Singapore . 552 parts In-Stock

1+ parts

$10.470

100+ parts

-

1k+ parts

-

10k+ parts

-

552

$10.470

-

-

-

Lixinc

USA . 9,463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,463

-

-

-

-

Fulton Briggs Corp.

USA . 3,574 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,574

-

-

-

-

Argo Parts USA

USA . 3,506 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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3,506

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Overview

Discover the power and efficiency of the DSPIC33EP32GS506-E/PT by Microchip Technology. As a leader in Digital Signal Processors (DSPs), Microchip Technology ensures top-quality products for a wide range of applications. With advanced features and cutting-edge technology, this product offers unparalleled value and benefits to customers looking to optimize their designs. From automotive to industrial applications, the DSPIC33EP32GS506-E/PT provides reliability and performance that will take your projects to the next level. See the difference with Microchip Technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for better handling and durability in electronic devices.

Surface Mount: YES

Allows for compact and efficient PCB design, saving space in electronic devices.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs for versatile applications.

Screening Level: AEC-Q100; TS 16949

Adheres to automotive quality standards for reliability and performance in automotive applications.

Bit Size: 16

Offers high precision and processing power for complex algorithms and calculations.

No. of Terminals: 64

Provides sufficient connectivity for interfacing with other components in the system.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Allows for a compact and thin form factor, ideal for space-constrained applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, suitable for a wide range of environments.

Maximum Operating Temperature: 125 °C

Capable of withstanding high temperatures without performance degradation.

Nominal Supply Voltage: 3.3 V

Efficient power consumption at a standard voltage level.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP32GS506-E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

DSPIC33EP32GS506-E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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