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DSPIC33EP32GP502T-E/SO

Microchip Technology

DSPIC33EP32GP502T-E/SO by Microchip Technology

DSPIC33EP32GP502T-E/SO by Microchip Technology is a 16-bit digital signal processor with 4096 RAM words and a max clock frequency of 60 MHz. Ideal for automotive applications, it features 3.3V power supplies, boundary scan capability, and operates in temperatures ranging from -40 to 125°C.

Median Price

$2.550

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.550

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$2.550

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-

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Vyrian

USA . 5,708 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,708

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,259 parts In-Stock

1+ parts

$16.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,259

$16.000

-

-

-

AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$16.528

100+ parts

-

1k+ parts

-

10k+ parts

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281

$16.528

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-

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Fulton Briggs Corp.

USA . 6,258 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,258

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$2.499

1k+ parts

$2.422

10k+ parts

$2.371

1,000

-

$2.499

$2.422

$2.371

Microchip USA

USA . 330 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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330

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Overview

Experience unparalleled performance and reliability with the Microchip Technology DSPIC33EP32GP502T-E/SO Digital Signal Processor. As a leader in the industry, Microchip delivers cutting-edge technology that meets the highest standards of quality and innovation. This DSP is perfect for a wide range of applications, offering customers exceptional value and benefits. From automotive to industrial automation, this product provides unmatched advantages, making it the ideal choice for your next project. Elevate your designs with the DSPIC33EP32GP502T-E/SO and unleash the full potential of your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to damage, ensuring the longevity of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto circuit boards, making assembly quick and cost-effective.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V provides a wide voltage range for power input, ensuring compatibility with a variety of systems.

On Chip Data RAM Width: 8

8-bit data RAM width allows for efficient data processing and storage, enhancing the performance of the digital signal processor.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it ideal for compact electronic devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures the product can withstand extended periods of use without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient operation and improved signal processing capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming of the read-only memory, enabling flexibility and customization of the digital signal processor.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP32GP502T-E/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

4096

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

DSPIC33EP32GP502T-E/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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