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DSPIC33EP256MU810T-I/BG

Microchip Technology

DSPIC33EP256MU810T-I/BG by Microchip Technology

DSPIC33EP256MU810T-I/BG by Microchip Technology is a 16-bit DSP with 28672 RAM words, operating at up to 60 MHz. Ideal for industrial applications, it features 9 timers, 15 DMA channels, and FLASH ROM programmability. With a low power mode and multiple internal bus architecture, this digital signal processor offers high performance in a compact square package.

Median Price

$12.780

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$12.780

100+ parts

-

1k+ parts

-

10k+ parts

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68

$12.780

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Vyrian

USA . 3,837 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,837

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 832 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

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832

$2.000

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-

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AZTECH Wire

Italy . 847 parts In-Stock

1+ parts

$7.210

100+ parts

-

1k+ parts

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10k+ parts

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847

$7.210

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Continental Prestige Electronics

USA . 2,971 parts In-Stock

1+ parts

$12.780

100+ parts

-

1k+ parts

-

10k+ parts

$12.524

2,971

$12.780

-

-

$12.524

Fulton Briggs Corp.

USA . 5,061 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,061

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Argo Parts USA

USA . 4,753 parts In-Stock

1+ parts

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100+ parts

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4,753

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$12.524

1k+ parts

$12.141

10k+ parts

$11.885

100

-

$12.524

$12.141

$11.885

Overview

Unlock the power of digital signal processing with Microchip Technology's DSPIC33EP256MU810T-I/BG. This top-of-the-line Digital Signal Processor offers unparalleled quality and reliability. Perfect for a wide range of applications, this product provides customers with exceptional value and benefits. Experience increased performance and efficiency with the DSPIC33EP256MU810T-I/BG, making it a must-have for any project requiring high-quality signal processing capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the DSP, making it suitable for various environments.

Surface Mount: YES

Being surface mountable makes the DSP easy to integrate into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power input options.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 allows for efficient data processing and storage capabilities.

Package Shape: SQUARE

The square package shape makes the DSP easy to handle and fit neatly into designs.

Bit Size: 16

With a bit size of 16, the DSP can handle complex calculations and processes efficiently.

Power Supplies (V): 3.3

The 3.3V power supply capability is common and compatible with many power sources.

No. of Terminals: 121

The high number of terminals allows for versatile connectivity and integration in various systems.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style offers a compact and efficient design for space-constrained applications.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures that the DSP can operate even with lower power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range of 85°C allows for reliable performance in various environmental conditions.

No. of External Interrupts: 5

Having 5 external interrupts enables the DSP to respond to external events quickly and efficiently.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the DSP can function in colder environments without issues.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom makes the DSP easier to mount and connect within circuits.

Maximum Seated Height: 1.2 mm

The low maximum seated height allows for a slim profile and space-saving installation of the DSP.

RAM Words: 28672

With a large RAM capacity of 28672 words, the DSP can store and process a significant amount of data efficiently.

Width: 10 mm

The compact width of 10mm makes the DSP suitable for small-scale applications and tight spaces.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the DSP during development and production stages.

Maximum Clock Frequency: 60 MHz

The high maximum clock frequency of 60MHz enables fast processing and execution of digital signals.

Internal Bus Architecture: MULTIPLE

The use of multiple internal bus architecture enhances data transfer speeds and overall performance of the DSP.

Length: 10 mm

The length of 10mm provides a compact form factor for the DSP, suitable for space-limited designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the DSP can operate reliably in harsh industrial environments with temperature fluctuations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Being a digital signal processor and controller, the DSP can efficiently handle and manipulate digital signals for various applications.

No. of Timers: 9

Having 9 timers allows for precise timing and synchronization of tasks within the DSP operations.

Technology: CMOS

The CMOS technology used in the DSP provides low power consumption, high speed, and noise immunity for efficient performance.

Terminal Form: BALL

The ball terminal form offers reliable connections and easy mounting of the DSP on circuit boards.

Maximum Supply Current: 320 mA

The maximum supply current of 320mA ensures stable and sufficient power delivery for the DSP to operate effectively.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a standard and widely compatible power input for the DSP.

No. of DMA Channels: 15

Having 15 DMA channels allows for efficient data transfer and processing without CPU intervention, enhancing overall performance.

ROM Programmability: FLASH

The flash ROM programmability offers flexibility and ease of updating firmware and programs on the DSP.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm enables high-density mounting of the DSP on PCBs, saving space and increasing overall system efficiency.

Format: FLOATING POINT

The floating-point format allows for precise mathematical calculations and processing of complex data in the DSP.

Low Power Mode: YES

The low power mode feature helps reduce power consumption during idle or low-demand situations, increasing energy efficiency of the DSP.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 enables efficient storage and execution of program instructions within the DSP.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MU810T-I/BG attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

121

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

28672

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

DSPIC33EP256MU810T-I/BG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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