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DSPIC33EP256MU810-E/BG

Microchip Technology

DSPIC33EP256MU810-E/BG by Microchip Technology

DSPIC33EP256MU810-E/BG by Microchip is a 16-bit DSP with 3.3V supply, 60MHz clock frequency, and 28672 RAM words. Ideal for automotive applications, it features 9 timers, 15 DMA channels, and FLASH ROM programmability in a compact square package with grid array terminals.

Median Price

$10.310

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 93 parts In-Stock

1+ parts

$10.310

100+ parts

-

1k+ parts

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10k+ parts

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93

$10.310

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Vyrian

USA . 6,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,490

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 318 parts In-Stock

1+ parts

$8.244

100+ parts

-

1k+ parts

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318

$8.244

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Continental Prestige Electronics

USA . 3,530 parts In-Stock

1+ parts

$10.310

100+ parts

-

1k+ parts

-

10k+ parts

$10.104

3,530

$10.310

-

-

$10.104

Netroflash

USA . 100 parts In-Stock

1+ parts

$10.310

100+ parts

-

1k+ parts

$9.795

10k+ parts

$9.588

100

$10.310

-

$9.795

$9.588

Ampacity Inc.

Singapore . 451 parts In-Stock

1+ parts

$35.000

100+ parts

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1k+ parts

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10k+ parts

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451

$35.000

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West Coast Incorporated

USA . 2,061 parts In-Stock

1+ parts

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2,061

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,000

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Argo Parts USA

USA . 1,402 parts In-Stock

1+ parts

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100+ parts

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1,402

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Overview

Discover the Microchip Technology DSPIC33EP256MU810-E/BG, a cutting-edge Digital Signal Processor designed to revolutionize your electronic projects. With its high-quality construction and innovative features, this device offers unparalleled performance and reliability. Whether you're working on automotive applications or intricate control systems, this DSP provides the power and efficiency you need to bring your ideas to life. Experience the value and benefits of using a top-tier manufacturer like Microchip Technology - trust in excellence, trust in innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the DSP, making it suitable for various environments.

Surface Mount: YES

Surface mount option allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Ability to operate at a maximum supply voltage of 3.6 V allows for flexibility in power supply options.

On Chip Data RAM Width: 8

8-bit data RAM width enables efficient data processing and storage capabilities for the DSP.

Package Shape: SQUARE

Square package shape helps in easy integration and placement on PCBs, optimizing space utilization.

Bit Size: 16

16-bit processing capability facilitates high-speed calculations and operations, enhancing overall performance.

Power Supplies (V): 3.3

Stable power supply at 3.3 V ensures reliable operation and prevents potential damage from voltage fluctuations.

No. of Terminals: 121

Abundance of 121 terminals provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array with thin profile and fine pitch design aids in compact packaging and high-density mounting, ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3 V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C allows for reliable operation in extreme thermal conditions.

No. of External Interrupts: 5

Availability of 5 external interrupts enables the DSP to efficiently handle and respond to external events in real-time.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures functionality in cold environments or during temperature fluctuations.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish provides corrosion resistance and reliable electrical connections for long-term performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout design and allows for easier soldering during assembly.

Maximum Seated Height: 1.2 mm

Low maximum seated height of 1.2 mm enables slim and compact device designs, maximizing space efficiency.

RAM Words: 28672

Large RAM capacity of 28672 words facilitates efficient storage and retrieval of data for complex signal processing tasks.

Width: 10 mm

Compact width of 10 mm allows for small form factor designs, ideal for applications with space constraints.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, enhancing the overall reliability and quality of the product.

Maximum Clock Frequency: 60 MHz

High maximum clock frequency of 60 MHz enables fast data processing and real-time signal manipulation, improving system performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and enables parallel processing, increasing computational efficiency.

Length: 10 mm

Compact length of 10 mm contributes to a space-saving design and facilitates integration into various electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliability and durability in automotive applications subjected to harsh environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionalities provides versatile signal processing capabilities along with control logic for diverse application requirements.

No. of Timers: 9

Availability of 9 timers enables precise timing control and synchronization of operations, essential for time-critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring energy-efficient and reliable operation of the DSP.

Terminal Form: BALL

Ball terminal form simplifies soldering and provides reliable electrical connections, contributing to the overall robustness of the product.

Maximum Supply Current: 320 mA

High maximum supply current of 320 mA supports power-hungry applications and ensures adequate power delivery for optimal performance.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures consistent and reliable operation, maintaining system integrity and performance.

No. of DMA Channels: 15

Abundance of 15 DMA channels facilitates efficient data transfer and processing, optimizing system performance and responsiveness.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization, enhancing the flexibility and scalability of the DSP.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm enables high-density mounting and enhances soldering accuracy, ideal for miniaturized electronic designs.

Format: FLOATING POINT

Floating-point format provides high precision and accuracy for mathematical calculations, essential for demanding signal processing tasks.

Low Power Mode: YES

Low power mode option allows for energy-efficient operation, extending battery life in portable devices and reducing overall power consumption.

On Chip Program ROM Width: 8

8-bit program ROM width facilitates efficient program storage and execution, enhancing the overall performance and responsiveness of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MU810-E/BG attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

121

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

28672

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

DSPIC33EP256MU810-E/BG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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