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DSPIC33EP256GP502-E/MM

Microchip Technology

DSPIC33EP256GP502-E/MM by Microchip Technology

DSPIC33EP256GP502-E/MM by Microchip Technology is a 16-bit digital signal processor with 3.3V power supply, 60MHz clock frequency, and 32768 RAM words. Ideal for automotive applications, it features CMOS technology, FLASH ROM programmability, and low power mode for efficient performance in various control systems.

Median Price

$5.050

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,080 parts In-Stock

1+ parts

$5.050

100+ parts

$4.170

1k+ parts

$3.860

10k+ parts

$3.670

1,080

$5.050

$4.170

$3.860

$3.670

Mouser Electronics

USA . 183 parts In-Stock

1+ parts

$5.050

100+ parts

$4.170

1k+ parts

-

10k+ parts

-

183

$5.050

$4.170

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 854 parts In-Stock

1+ parts

$5.240

100+ parts

$4.750

1k+ parts

$4.340

10k+ parts

-

854

$5.240

$4.750

$4.340

-

Vyrian

USA . 2,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,117

-

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,423 parts In-Stock

1+ parts

$4.290

100+ parts

-

1k+ parts

-

10k+ parts

-

1,423

$4.290

-

-

-

AZTECH Wire

Italy . 210 parts In-Stock

1+ parts

$19.280

100+ parts

-

1k+ parts

-

10k+ parts

-

210

$19.280

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,000

-

-

-

-

RGB Technical Solutions

Ukraine . 1,901 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,901

-

-

-

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Overview

Unleash the power of cutting-edge technology with the Microchip Technology DSPIC33EP256GP502-E/MM Digital Signal Processor. Designed for high performance and reliability, this product offers unmatched quality and superior functionality. Ideal for a wide range of applications, this DSP delivers unparalleled value and benefits to customers looking for efficient processing capabilities. Trust in the expertise of Microchip Technology and experience the advantages that this innovative product brings to your projects. Elevate your designs with the DSPIC33EP256GP502-E/MM and unlock endless possibilities in digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for long-term use.

Surface Mount: YES

Being surface mountable makes installation and integration of the DSP easier in various electronic devices.

Maximum Supply Voltage: 3.6 V

This voltage level allows for a wide range of power supply compatibility, ensuring flexibility in different applications.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and efficient performance of the DSP.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space in electronic devices.

Bit Size: 16

A 16-bit size enables the DSP to handle complex computations and data processing tasks effectively.

No. of Terminals: 28

Having a sufficient number of terminals allows for seamless connectivity and communication with other components in the system.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the DSP can operate in extreme conditions without performance degradation.

Maximum Clock Frequency: 60 MHz

The high clock frequency enables fast data processing and real-time signal handling, making the DSP suitable for demanding applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256GP502-E/MM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Trade Compliance

DSPIC33EP256GP502-E/MM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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