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DSPIC33EP128MC504T-I/MV

Microchip Technology

DSPIC33EP128MC504T-I/MV by Microchip Technology

DSPIC33EP128MC504T-I/MV by Microchip Technology is a 16-bit DSP with 16384 RAM words, operating at up to 60 MHz. Ideal for industrial applications, it features 3.3 V nominal voltage, -40 to 85 °C temperature range, and boundary scan capability.

Median Price

$5.166

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 82 parts In-Stock

1+ parts

$5.166

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82

$5.166

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Vyrian

USA . 4,129 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

$5.166

100+ parts

$4.908

1k+ parts

$4.662

10k+ parts

$4.598

120

$5.166

$4.908

$4.662

$4.598

Continental Prestige Electronics

USA . 1,987 parts In-Stock

1+ parts

$5.166

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$5.063

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$5.063

AZTECH Wire

Italy . 561 parts In-Stock

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$10.353

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Ampacity Inc.

Singapore . 859 parts In-Stock

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$18.000

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$18.000

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Microchip USA

USA . 6,044 parts In-Stock

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$25.844

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6,044

$25.844

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Corohmni

South Africa . 6 parts In-Stock

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$29.345

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6

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Aztec Data Supply Inc.

USA . 945 parts In-Stock

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$67.047

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945

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Authorized Procurement Solutions

USA . 351,316 parts In-Stock

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Lixinc

USA . 8,293 parts In-Stock

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Fulton Briggs Corp.

USA . 5,508 parts In-Stock

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Argo Parts USA

USA . 4,432 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the DSPIC33EP128MC504T-I/MV by industry leader Microchip Technology. This cutting-edge DSP offers unparalleled performance and reliability in a compact package, perfect for industrial applications that demand high-speed data processing. With advanced features like low power mode and flash ROM programmability, this versatile chip delivers exceptional value and efficiency to customers looking to optimize their systems. Trust Microchip Technology to provide the quality and innovation you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material makes the product suitable for a wide range of applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing flexibility in usage.

On Chip Data RAM Width: 8

The 8-bit data RAM width provides efficient data processing capabilities, enhancing overall performance.

Screening Level: TS 16949

This screening level ensures high quality and reliability, making the product a dependable choice for industrial applications.

Package Shape: SQUARE

The square package shape is space-saving and easy to handle, making it a practical choice for compact designs.

Bit Size: 16

The 16-bit size allows for complex data manipulation, making the product suitable for advanced signal processing tasks.

No. of Terminals: 48

With a high number of terminals, this product offers versatile connectivity options for various peripheral devices.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combines heat dissipation and compact design, making it ideal for applications with limited space and thermal constraints.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128MC504T-I/MV attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

16384

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

.55 mm

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

DSPIC33EP128MC504T-I/MV Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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