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DSPIC33EP128GM710-I/BG

Microchip Technology

DSPIC33EP128GM710-I/BG by Microchip Technology

DSPIC33EP128GM710-I/BG by Microchip Technology is a 16-bit digital signal processor with 16384 RAM words and a max clock frequency of 60 MHz. Ideal for industrial applications, it features 13 timers, 4 DMA channels, and operates at temperatures ranging from -40 to 85°C.

Median Price

$8.580

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 5,520 parts In-Stock

1+ parts

$8.580

100+ parts

$7.110

1k+ parts

$6.550

10k+ parts

$6.230

5,520

$8.580

$7.110

$6.550

$6.230

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 4,416 parts In-Stock

1+ parts

$8.900

100+ parts

$8.070

1k+ parts

$7.380

10k+ parts

-

4,416

$8.900

$8.070

$7.380

-

Bristol Electronics

USA . 184 parts In-Stock

1+ parts

$11.202

100+ parts

$4.593

1k+ parts

-

10k+ parts

-

184

$11.202

$4.593

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Vyrian

USA . 3,771 parts In-Stock

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3,771

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Dan-Mar Components

USA . 184 parts In-Stock

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184

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,137 parts In-Stock

1+ parts

$7.290

100+ parts

-

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5,137

$7.290

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AZTECH Wire

Italy . 125 parts In-Stock

1+ parts

$11.520

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125

$11.520

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QualityLine Systems

Poland . 3,658 parts In-Stock

1+ parts

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3,658

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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XL Components Corporation

Australia . 2,396 parts In-Stock

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2,396

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Marpe Global Electronics

Taiwan . 440 parts In-Stock

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440

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Experience the power of cutting-edge technology with the DSPIC33EP128GM710-I/BG by industry leader Microchip Technology. This advanced Digital Signal Processor offers unparalleled performance and reliability for a wide range of applications. With features like low power mode, flash ROM programmability, and a maximum clock frequency of 60 MHz, this product provides exceptional value and benefits to customers seeking high-quality solutions. Trust in Microchip's expertise and invest in the future of digital signal processing with the DSPIC33EP128GM710-I/BG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options for the DSP, accommodating a wider range of applications.

On Chip Data RAM Width: 8

The 8-bit width of the on-chip data RAM allows for efficient data processing and storage, enhancing the performance of the DSP.

Maximum Clock Frequency: 60 MHz

With a high maximum clock frequency of 60 MHz, the DSP can handle complex signal processing tasks quickly and efficiently.

No. of External Interrupts: 5

Having 5 external interrupts enables the DSP to respond quickly to external events, improving its real-time performance in interrupt-driven applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in various operating conditions.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GM710-I/BG attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of Serial I/Os:

4

No. of Terminals:

121

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

DSPIC33EP128GM710-I/BG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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