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DSPIC30F3010T-30I/ML

Microchip Technology

DSPIC30F3010T-30I/ML by Microchip Technology

DSPIC30F3010T-30I/ML by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 85°C, and flash ROM programmability. Ideal for industrial applications requiring digital signal processing and control functions in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,246 parts In-Stock

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Nova Conductors

Japan . 99 parts In-Stock

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99

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Ampacity Inc.

Singapore . 2,779 parts In-Stock

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$6.010

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$6.010

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AZTECH Wire

Italy . 842 parts In-Stock

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$11.780

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842

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QUARKTWIN TECHNOLOGY LTD

USA . 20,627 parts In-Stock

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West Coast Incorporated

USA . 3,766 parts In-Stock

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Corohmni

South Africa . 943 parts In-Stock

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Argo Parts USA

USA . 795 parts In-Stock

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Continental Prestige Electronics

USA . 505 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Unlock the power of digital signal processing with the Microchip Technology DSPIC30F3010T-30I/ML. Manufactured by a trusted industry leader, this advanced DSP offers unmatched quality and reliability. Ideal for a wide range of applications, this product boasts a compact design and impressive performance capabilities. With a maximum clock frequency of 40 MHz and a Flash programmable ROM, customers can expect fast, efficient operation for their projects. Experience the value and benefits of cutting-edge technology with the DSPIC30F3010T-30I/ML from Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable packaging for the DSP.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Can handle high supply voltages for versatile applications.

Bit Size: 16

Offers high processing capability for complex algorithms and computations.

Power Supplies (V): 3/5

Supports multiple power supply options for flexibility in design.

No. of Terminals: 44

Provides ample connectivity for interfacing with other devices in a system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combines different packaging styles for efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without degradation in performance.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions without loss of functionality.

Terminal Finish: Matte Tin (Sn)

Provides a reliable and corrosion-resistant finish for the terminals.

Terminal Position: QUAD

Quad terminal position allows for secure connections and ease of soldering.

Maximum Clock Frequency: 40 MHz

Offers high-speed processing capability for real-time applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combines DSP and controller functions in one chip for versatile system integration.

ROM Programmability: FLASH

Allows for easy reprogramming of the on-chip ROM for firmware updates or customization.

Technology: CMOS

CMOS technology offers low power consumption and high integration for efficient operation.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage for compatibility with a wide range of systems.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F3010T-30I/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

44

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

DSPIC30F3010T-30I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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