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APA600-BGG456

Microchip Technology

APA600-BGG456 by Microchip Technology

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

Median Price

$785.690

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 30 parts In-Stock

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$785.690

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30

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Microchip Technology

USA . 18 parts In-Stock

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$785.690

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$774.920

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$448.970

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18

$785.690

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$448.970

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Distributors (In-Stock)

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Digiode

USA . 493 parts In-Stock

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$746.406

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Vyrian

USA . 165 parts In-Stock

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Chip Stock

USA . 1,417 parts In-Stock

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Advanced Electronics

New Zealand . 1,681 parts In-Stock

1+ parts

$128.677

100+ parts

$117.096

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$105.515

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1,681

$128.677

$117.096

$105.515

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Semicontronic

India . 72 parts In-Stock

1+ parts

$667.840

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$651.144

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$647.805

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72

$667.840

$651.144

$647.805

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Corphita

USA . 140 parts In-Stock

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$707.121

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Corohmni

South Africa . 167 parts In-Stock

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$754.264

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QUARKTWIN TECHNOLOGY LTD

USA . 24,446 parts In-Stock

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CPlus Electronics

USA . 23,500 parts In-Stock

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Microchip USA

USA . 6,126 parts In-Stock

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West Coast Incorporated

USA . 4,237 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Perfect Parts

USA . 27 parts In-Stock

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Technical Specifications

Field Programmable Gate Arrays (FPGA) APA600-BGG456 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

21504

No. of Inputs:

356

No. of Outputs:

356

No. of Equivalent Gates:

600000

Maximum Clock Frequency:

180 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

600000 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.3 V

Maximum Supply Voltage:

2.7 V

Power Supplies:

2.5,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

2.54 mm

Packing Method:

Tray

Package Equivalence Code:

BGA456,26X26,50

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1.27 mm

No. of Terminals:

456

Standards

JESD-30 Code:

S-PBGA-B456

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

APA600-BGG456 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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