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93LC76B-I/SN

Microchip Technology

93LC76B-I/SN by Microchip Technology

93LC76B-I/SN by Microchip Tech is a 512x16 EEPROM with 2MHz clock freq. Ideal for industrial applications, it offers 1000000 write/erase cycles, operates at -40 to 85°C, and supports MICROWIRE serial bus. With software write protection and totem pole output, this CMOS device has a small outline package measuring 4.9mm x 3.9mm x 1.75mm.

Median Price

$0.475

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 19,380 parts In-Stock

1+ parts

$0.460

100+ parts

$0.420

1k+ parts

$0.410

10k+ parts

$0.370

19,380

$0.460

$0.420

$0.410

$0.370

Mouser Electronics

USA . 121 parts In-Stock

1+ parts

$0.490

100+ parts

$0.475

1k+ parts

-

10k+ parts

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121

$0.490

$0.475

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 15,500 parts In-Stock

1+ parts

$0.520

100+ parts

$0.470

1k+ parts

$0.420

10k+ parts

-

15,500

$0.520

$0.470

$0.420

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Vyrian

USA . 4,657 parts In-Stock

1+ parts

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4,657

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VNN

France . 1,000 parts In-Stock

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1,000

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 9,521 parts In-Stock

1+ parts

$0.391

100+ parts

$0.381

1k+ parts

$0.379

10k+ parts

-

9,521

$0.391

$0.381

$0.379

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Ampacity Inc.

Singapore . 9,299 parts In-Stock

1+ parts

$0.391

100+ parts

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9,299

$0.391

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Corohmni

South Africa . 1,112 parts In-Stock

1+ parts

$0.431

100+ parts

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1,112

$0.431

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CoreStaff

Japan . 800 parts In-Stock

1+ parts

$1.600

100+ parts

$0.615

1k+ parts

$0.578

10k+ parts

-

800

$1.600

$0.615

$0.578

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Andel Nordic

Denmark . 1,457 parts In-Stock

1+ parts

$23.140

100+ parts

-

1k+ parts

$16.199

10k+ parts

$16.199

1,457

$23.140

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$16.199

$16.199

West Coast Incorporated

USA . 8,250 parts In-Stock

1+ parts

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8,250

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Argo Parts USA

USA . 1,749 parts In-Stock

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1,749

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Perfect Parts

USA . 1,420 parts In-Stock

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1,420

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Continental Prestige Electronics

USA . 634 parts In-Stock

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634

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Overview

Unlock the power of reliable data storage with the 93LC76B-I/SN by Microchip Technology. As a leader in the industry, Microchip Technology delivers top-notch EEPROM products like the 93LC76B-I/SN that offer unmatched quality and performance. Perfect for a wide range of applications, this EEPROM provides customers with a secure and efficient solution for storing essential data. Trust Microchip Technology to provide you with a product that not only meets, but exceeds your expectations, ensuring that your data is safe and accessible whenever you need it. Experience the value and benefits that only the 93LC76B-I/SN can offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the EEPROM, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

Screening Level: TS 16949

Compliance with TS 16949 standards ensures high quality and reliability in automotive applications.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster data transfer and communication within the system.

Nominal Supply Voltage / Vsup (V): 3

Works efficiently at a 3V supply voltage, suitable for a wide range of electronic devices.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies, offering flexibility in system design.

No. of Terminals: 8

Provides multiple connection points for interfacing with other components, enhancing compatibility.

Package Style (Meter): SMALL OUTLINE

Compact small outline package saves space and is suitable for small electronic devices.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial applications.

Organization: 512X16

Organized in a 512x16 configuration for efficient data storage and retrieval.

Output Characteristics: TOTEM POLE

Efficient totem pole output characteristics for high-speed data communication.

Minimum Operating Temperature: -40 °C

Operates reliably in low temperatures, suitable for a wide range of environments.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and ensures reliable soldering connections.

Terminal Position: DUAL

Dual terminal position for flexibility in PCB layout and design.

Write Protection: SOFTWARE

Software-enabled write protection for data security and integrity.

Maximum Seated Height: 1.75 mm

Low-profile design with a maximum seated height of 1.75 mm for space-constrained applications.

Maximum Clock Frequency (fCLK): 2 MHz

Supports a maximum clock frequency of 2 MHz for efficient data transfer.

Width: 3.9 mm

Narrow width of 3.9 mm for compatibility with compact electronic devices.

Minimum Supply Voltage (Vsup): 2.5 V

Operates at a minimum supply voltage of 2.5V, ensuring reliable performance in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

30-second maximum time at peak reflow temperature for safe and reliable soldering processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C for secure soldering connections.

Length: 4.9 mm

Compact length of 4.9 mm for space-saving PCB designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating for reliable operation in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance.

Parallel or Serial: SERIAL

Serial interface for efficient data transfer and communication with other components.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering connections and ease of assembly.

Maximum Supply Current: 3 mA

Low maximum supply current of 3 mA for energy efficiency.

No. of Words: 512 words

Offers a total of 512 words for data storage.

Toggle Bit: YES

Toggle bit functionality for efficient data storage and retrieval.

Memory Width: 16

16-bit memory width for storing and accessing data efficiently.

Minimum Data Retention Time: 200

Minimum data retention time of 200 years for long-lasting data integrity.

Terminal Pitch: 1.27 mm

Standard 1.27 mm terminal pitch for compatibility with various PCB designs.

No. of Words Code: 512

512 words code for efficient data organization and access.

Ready or Busy: YES

Ready or busy status feature for monitoring the operational state of the EEPROM.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a maximum supply voltage of 5.5V for flexibility in power supply options.

Endurance: 1000000 Write/Erase Cycles

High endurance rating of 1,000,000 write/erase cycles for reliable data storage.

Serial Bus Type: MICROWIRE

Microwire serial bus type for efficient data transfer and communication.

Maximum Write Cycle Time (tWC): 5 ms

Fast maximum write cycle time of 5 ms for quick data storage operations.

Memory Density: 8192 bit

High memory density of 8192 bits for storing a large amount of data.

Memory IC Type: EEPROM

Utilizes EEPROM memory IC type for non-volatile and reliable data storage.

Maximum Standby Current: 0.000001 Amp

Ultra-low maximum standby current of 0.000001 Amp for energy efficiency in standby mode.

Technical Specifications

EEPROM 93LC76B-I/SN attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X16

Output Characteristics:

TOTEM POLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Ready or Busy:

YES

Reverse Pinout:

NO

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Toggle Bit:

YES

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

93LC76B-I/SN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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